Search for dissertations about: "3D hexagonal"

Showing result 1 - 5 of 19 swedish dissertations containing the words 3D hexagonal.

2. 1. Mesostructured particulate silica materials with tunable pore size : Synthesis, characterization and applications

   Author : Malin Helena Sörensen; Per Claesson; Viveka Alfredsson; KTH; []
   Keywords : MEDICIN OCH HÄLSOVETENSKAP; MEDICAL AND HEALTH SCIENCES; Mesoporous materials; aersol-based process; emulsion-based process; biocatalysis; sustained release; 3D hexagonal; 2D hexagonal; powder; spherical particles; liquid crystalline phases; AFM-porosimetry; Pluronic; Chemistry; Kemi;

   Abstract : Colloidal assemblies of surfactants and polymers in aqueous solutions have been used by human mankind for hundreds of years and they are of great importance in many of our technological processes, such as fabrication of soap and papermaking. Less than two decades ago the idea of using colloidal assemblies as templates of inorganic materials was borne. READ MORE

4. 2. Towards 3D Integration of Carbon Based Electronics

   Author : Wei Mu; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; transfer; carbon nanomaterials; polymer filling; MWCNTs; interconnect; 3D integration; packaging; graphene; horizontally aligned SWCNTs; through silicon via;

   Abstract : Carbon-based nanomaterials such as carbon nanotubes (CNTs) and graphene, which possess superior electrical, thermal and mechanical properties, have been proposed as alternative materials for future electronics. The proposed applications span from the device level, replacing silicon-based transistors, with single-walled carbon nanotubes (SWCNTs) or graphene, to packaging level using multi-walled carbon nanotubes (MWCNTs) for interconnects. READ MORE

5. 3. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

   Author : Shuangxi Sun; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TIM; G-CNT; electrical resistivity; VA-CNTs; thermal resistance; 3D IC integration; TSV; graphene; VA-CNT-Solder; VA-CNT-Cu;

   Abstract : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. READ MORE

6. 4. 3D Integration of Carbon Based Electronics

   Author : Wei Mu; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

   Abstract : Carbon-based nanomaterials such as carbon nanotubes (CNTs) and graphene, which possess superior electrical, thermal and mechanical properties, have been proposed as alternative materials for future electronics. The proposed applications span from the device level, replacing silicon-based transistors, with single-walled carbon nanotubes (SWCNTs) or graphene, to packaging level using multi-walled carbon nanotubes (MWCNTs) for interconnects. READ MORE

7. 5. Study of the flow-induced structure and anisotropy in lyotropic liquid crystals for hierarchical composites

   Author : Adrian Rodriguez Palomo; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; Self-assembly; Lyotropic liquid crystals; SAXS; Hierarchical materials.; 3D printing; Rheology; Microfluidics; Birefringence microscopy;

   Abstract : Controlling the micro and nanostructure of materials is highly beneficial in order to tailor their physical properties. Extrusion-based 3D printing is a promising tool to produce hierarchical structures with controlled architecture. READ MORE