Search for dissertations about: "Anisotropic Conductive Adhesive"
Showing result 1 - 5 of 8 swedish dissertations containing the words Anisotropic Conductive Adhesive.
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1. High frequency properties of electrically conductive adhesive interconnections and multilayer substrates
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2. Adhesion Characterization and Reliability Issues of Anisotropic Conductive Adhesives for Microsystem Applications
Abstract : There has been a steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. Simple processing, low bonding temperature and fine-pitch capability are the major advantages of conducting adhesive technology. READ MORE
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3. Thermal Characterization and Modelling in Microsystem Packaging Applications
Abstract : As the electronics circuits grow denser and the power consumption per area unit is increasing, new more efficient technologies for heat removal is necessary. Heat fluxes from the integrated circuit, IC, in the order of 100W/cm2 are not rare. READ MORE
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4. System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate
Abstract : System-in-a-Package (SiP) is one of the most advanced approaches to meet the requirements for future high-density electronics packaging. In this thesis, a 3D system-in-a-package concept with embedded active and passive components is proposed, where a liquid crystal polymer (LCP) was used as the base substrate. READ MORE
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5. Characterization of RF properties for system-in-a-package and anisotropic conductive adhesive flip- chip inter connection
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