Search for dissertations about: "RF integration"

Showing result 1 - 5 of 74 swedish dissertations containing the words RF integration.

  2. 1. Multiband LNA Design and RF-Sampling Front-Ends for Flexible Wireless Receivers

    Author : Stefan Andersson; Christer Svensson; Marc Tiebout; Linköpings universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; RF; Microelectronics; Multiband LNAs; RF-Sampling; Sampling Front-Ends; Flexible Wireless Receivers; Multistandard Receivers.; Electronics; Elektronik;

    Abstract : The wireless market is developing very fast today with a steadily increasing number of users all around the world. An increasing number of users and the constant need for higher and higher data rates have led to an increasing number of emerging wireless communication standards. READ MORE

  4. 2. Sequential 3D Integration - Design Methodologies and Circuit Techniques

    Author : Panagiotis Chaourani; Ana Rusu; Saul Rodriguez; Per-Erik Hellström; Georges Gielen; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; sequential 3D integration; monolithic inter-tier vias; design platforms; parasitic extraction flows; RF AMS circuits; inductors; heterogeneous integration; germanium transistors; Informations- och kommunikationsteknik; Information and Communication Technology;

    Abstract : Sequential 3D (S3D) integration has been identified as a potential candidate for area efficient ICs. It entails the sequential processing of tiers of devices, one on top the other. READ MORE

  5. 3. Active and Passive Unequally Spaced Reflect-Arrays and Elements of RF Integration Techniques

    Author : Dhanesh G. Kurup; Anders Rydberg; Mohamed Himdi; Peter S Hall; Uppsala universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electrical engineering; Active Antenna; Reflect-arrays; NRD guide; RF integration; Elektroteknik; elektronik och fotonik; Electrical engineering; electronics and photonics; Elektroteknik; elektronik och fotonik;

    Abstract : Using an array synthesis tool based on a modified differential evolution algorithm, it is shown that the position-phase synthesis exhibits improved pattern characteristics compared to both the phase only and position only synthesis of uniform amplitude antenna arrays. The design of an unequally spaced planar reflect-array and an active power combining reflect-array are presented. READ MORE

  6. 4. Vertical Heterostructure III-V MOSFETs for CMOS, RF and Memory Applications

    Author : Adam Jönsson; Nanoelektronik; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Nanowire; MOSFET; CMOS; RRAM; III-V; InAs; GaSb; InGaAs; Heterostructure; vertical; nanowire NW ; MOSFET; III-V materials; RRAM; RF; CMOS; InAs; GaSb; InGaAs; heterostructure; Vertical nanowire;

    Abstract : This thesis focuses mainly on the co-integration of vertical nanowiren-type InAs and p-type GaSb MOSFETs on Si (Paper I & II), whereMOVPE grown vertical InAs-GaSb heterostructure nanowires areused for realizing monolithically integrated and co-processed all-III-V CMOS.Utilizing a bottom-up approach based on MOVPE grown nanowires enablesdesign flexibilities, such as in-situ doping and heterostructure formation,which serves to reduce the amount of mask steps during fabrication. READ MORE

  7. 5. Design and Characterization of RF-LDMOS Transistors and Si-on-SiC Hybrid Substrates

    Author : Sara Lotfi; Jörgen Olsson; Örjan Vallin; Jean-Pierre Raskin; Uppsala universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; LDMOS; RF; losses; crosstalk; silicon carbide; Si-on-SiC hybrid substrate; wafer bonding; CMOS; Teknisk fysik med inriktning mot elektronik; Engineering Science with specialization in Electronics;

    Abstract : With increasing amount of user data and applications in wireless communication technology, demands are growing on performance and fabrication costs. One way to decrease cost is to integrate the building blocks in an RF system where digital blocks and high power amplifiers then are combined on one chip. READ MORE