Search for dissertations about: "chemical mechanical planarization"

Found 3 swedish dissertations containing the words chemical mechanical planarization.

  2. 1. Chemical Mechanical Polishing of Silicon and Silicon Dioxide in Front End Processing

    Author : Markus Forsberg; Jörgen Olsson; Jyrki Molarius; Uppsala universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electronics; chemical mechanical polishing; chemical mechanical planarization; silicon; silicon dioxide; front end; shallow trench isolation; deep trench isolation; bipolar transistor; BiCMOS; wafer bonding; Elektronik; Electronics; Elektronik;

    Abstract : Chemical mechanical polishing (CMP) has been used for a long time in the manufacturing of prime silicon wafers for the IC industry. Lately, other substrates, such as silicon-on-insulator has become in use which requires a greater control of the silicon CMP process. READ MORE

  4. 2. Waste Heat Driven Membrane Distillation for Industrial Wastewater Treatment

    Author : Imtisal-e- Noor; Andrew R. Martin; Olli Dahl; Mikel Duke; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Membrane Distillation; Experimental investigations; Techno-economic; Wastewater; Flue gas condensate; Waste heat; District heating; Nano-electronics; Cogeneration; Sustainable development; Energy Technology; Energiteknik; Chemical Engineering; Kemiteknik;

    Abstract : The European Union has placed a high priority on reaching the goals described in the 2030 Agenda for Sustainable Development. This aim has provided added momentum to member-state environmental regulatory authorities to further tighten the discharge limits of industrial wastewater. READ MORE

  5. 3. Fabrication of Group IV Semiconductors on Insulator for Monolithic 3D Integration

    Author : Ali Asadollahi; Mikael Östling; Paul R. Berger; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; monolithic three dimensional M3D integration; strained germanium on insulator sGeOI pMOSFETs; silicon silicon-germanium on insulator sSOI sSiGeOI nMOSFETs; Si0.5Ge0.5 strain-relaxed buffer SRB ; direct bonding; chemical mechanical polishing CMP ; compressively strained GeOI; tensile strained Si0.5Ge0.5OI;

    Abstract : The conventional 2D geometrical scaling of transistors is now facing many challenges in order to continue the performance enhancement while decreasing power consumption. The decrease in the device power consumption is related to the scaling of the power supply voltage (Vdd) and interconnects wiring length. READ MORE