Search for dissertations about: "chip-level"

Found 5 swedish dissertations containing the word chip-level.

2. 1. Towards Unconventional Applications of Wire Bonding

   Author : Stephan Schröder; Frank Niklaus; Michael Mayer; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; wire bonding; wire integration; transfer wafer bonding; nondispersive infrared gas sensing; low-stress packaging; shape memory alloy SMA ; infrared IR emitter; through silicon via TSV ; ethanol sensing; nitric oxide gas sensing; wafer-level; chip-level; Kanthal; nickel chromium NiCr ; Electrical Engineering; Elektro- och systemteknik;

   Abstract : This thesis presents novel heterogeneous integration approaches of wire materials to fabricated and package MEMS devices by exploring unconventional applications of wire bonding technology. Wire bonding, traditionally endemic in the realm of device packaging to establish electrical die-to-package interconnections, is an attractive back-end technology, offering promising features, such as high throughput, flexibility and placement accuracy. READ MORE

4. 2. Integration and Fabrication Techniques for 3D Micro- and Nanodevices

   Author : Andreas C. Fischer; Frank Niklaus; Karl F. Böhringer; KTH; []
   Keywords : Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; chip-level; through silicon via; TSV; packaging; 3D packaging; vacuum packaging; liquid encapsulation; integration; heterogeneous integration; wafer bonding; microactuators; shape memory alloy; SMA; wire bonding; magnetic assembly; self-assembly; 3D; 3D printing; focused ion beam; FIB;

   Abstract : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. READ MORE

5. 3. Design of High Linearity MMIC Power Amplifiers for Space Applications

   Author : Oliver Silva Barrera; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; pHEMT; GaAs; reliability; Power amplifier; non-linear modeling; Junction temperature; C-Band; Infrared measurements;

   Abstract : The high linearity performance in satellite transmitters is receiving increasing attention due to the demands of higher data rates in satellite communication links. During the last decade, digital communication links in satellite system have been replacing the previous analog links increasing the channel efficiency by allocating multiple carriers in the transponder bandwidth. READ MORE

6. 4. Alternative electronic packaging concepts for high frequency electronics

   Author : Wolfgang Peter Siebert; Sture Petersson; Shaofang Gong; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electrical engineering; Connector; cooling; electronic; elastomer interconnect; EMC; shielded enclosure; high frequency; PCB; PWB; reverberation chamber; seams; soldering; twisted pair cable; Elektroteknik; Electrical engineering; Elektroteknik;

   Abstract : The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize the technology of electronic packaging. READ MORE

7. 5. Flip-Chip Interconnect for Millimeter-Wave Packaging Applications

   Author : Li-Han Hsu; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Underfill; Packaging; V-band; Fabrication; Millimeter-Waves; MMICs; 60 GHz; Multi-Chip Module; Interconnect; Organic laminate; Reliability.; Flip-Chip; Design;

   Abstract : In recent years, with the demands for wireless communication systems increas rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC components but also competent package with low cost and good interconnect performance. READ MORE