Search for dissertations about: "electroless plating"

Found 3 swedish dissertations containing the words electroless plating.

  2. 1. Process development and Reliability Study for System-in-a-Package by using a Liquid Crystal Polymer Substrate

    Author : Liu Chen; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; and Adhesion; Finite Element Simulation; Embedded Active and Passives Technology; System-in-a-Package; Liquid Crystal Polymer; Electroless Copper Plating;

    Abstract : System-in-a-package (SiP) aims to integrate all of the system functions within a system-level package, containing multiple ICs and other components interconnected through a high-density substrate. SiP is characterized by dividing chip functions among several smaller chips, by connecting chips in the first stage of board manufacture, and by integrating passive components in the substrate. READ MORE

  4. 2. Multifunctionality and Durability of Cellulosic Fiber Reinforced Polymer Composites

    Author : Zainab Al-Maqdasi; Roberts Joffe; Nazanin Emami; Liva Pupure; Tatiana Glaskova-Kuzmina; Luleå tekniska universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Polymeric Composite Materials; Polymera kompositmaterial;

    Abstract : The overall objective of this thesis is to develop and evaluate cellulose-based fiber composites with added multifunctionality for advanced applications. In the strive towards sustainable societies and industries, materials as well as production processes need to be assessed against the sustainability criteria and selected accordingly. READ MORE

  5. 3. An Electron Microscopy Study on Materials in Electronic Packaging

    Author : Lilei Ye; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; MOS; conductive adhesives; Cu7Sn6; microstructure; SEM; lead-free solders; TEM; crystal structure; Cu6Sn5; modulation structure;

    Abstract : This thesis is concerned with an investigation of the microstructure on materials in electronic packaging. The materials include Ag-filled conductive adhesives, Sn-Ag-based lead free solders and metal-oxide semiconductors. READ MORE