Search for dissertations about: "electronics engineering thesis"
Showing result 1 - 5 of 823 swedish dissertations containing the words electronics engineering thesis.
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1. Soft Intelligence : Liquids Matter in Compliant Microsystems
Abstract : Soft matter, here, liquids and polymers, have adaptability to a surrounding geometry. They intrinsically have advantageous characteristics from a mechanical perspective, such as flowing and wetting on surrounding surfaces, giving compliant, conformal and deformable behavior. READ MORE
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2. Component and system design of a mild hybrid 48 V powertrain for a light vehicle
Abstract : This thesis presents contributions in three areas relevant for the development of 48 V mild hybrid electric powertrains for cars. The first part comprises methodologies and extensive testing of lithium-ion battery cells in order to establish the electric and thermal performance using equivalent circuit models. READ MORE
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3. Characterization of nano-scale materials for interconnect and thermal dissipation application in electronics packaging
Abstract : This thesis focuses on studies of nano-scale materials in electronic packaging applications with respect to following aspects: surface analysis of nano-scale oxide of lead-free solder particles, and thermal performance and mechanical property studies of nano-scale fiber and metal composite-based thermal interface materials. The composition and thickness of the solder oxide have a direct impact on the quality of interconnects and the reliability of a packaged system. READ MORE
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4. Experimental investigations of ageing of commercial BEV Li-ion batteries
Abstract : The rapid development of lithium-ion batteries has enabled changes in widespread applications ranging from portable electronics to electric vehicles and large scale grid energy storage. However, battery ageing remain a challenge in all these applications, and this thesis seeks to contribute to the understanding of Li-ion battery degradation. READ MORE
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5. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics
Abstract : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. READ MORE