Search for dissertations about: "oxygen plasma assisted bonding"

Showing result 1 - 5 of 6 swedish dissertations containing the words oxygen plasma assisted bonding.

  2. 1. Oxygen plasma assisted silicon wafer bonding

    Author : Petra Amirfeiz; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; surface energy; diffusion; water; porous silica; oxygen plasma; wafer bonding;

    Abstract : .... READ MORE

  4. 2. Plasma assisted low temperature semiconductor wafer bonding

    Author : Donato Pasquariello; Uppsala universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Materials science; Wafer Bonding; Oxygen Plasma; InP; Si; Semiconductor; Materialvetenskap; Materials science; Teknisk materialvetenskap; materialvetenskap; Materials Science;

    Abstract : Direct semiconductor wafer bonding has emerged as a technology to meet the demand foradditional flexibility in materials integration. The applications are found in microelectronics, optoelectronics and micromechanics. For instance, wafer bonding is used to produce silicon-on-insulator (SOI) wafers. READ MORE

  5. 3. The RDGT - Integration of Micromechanics and Electronics by Plasma Assisted Wafer Bonding

    Author : Anke Sanz-Velasco; Chalmers tekniska högskola; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; bonding; displacement measurement; oxygen plasma; low temperature wafer bonding; capacitive detection; high resolution; CMOS compatibility; MOSFET; low impedance sensing; resonant gate transistor;

    Abstract : A high-resolution capacitive sensing technique is presented in this thesis: the Resonant Double Gate Transistor (RDGT). The major advantage of the RDGT compared to "pure" capacitive sensing techniques is its low output impedance because of the direct capacitance to current conversion of the transistor. READ MORE

  6. 4. Low temperature transfer bonding for MEMS. Utilizing and characterizing oxygen plasma assisted direct wafer bonding

    Author : Martin Bring; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; transfer bonding; chevron notch; oxygen plasma assisted bonding; Low temperature bonding; fracture toughness;

    Abstract : Transfer bonding enables the integration of devices, e.g. integrated circuits (ICs) and transducers, fabricated using processes and/or designs that are not compatible with each other as well as double sided micromachining of thin films. READ MORE

  7. 5. Wafer Bonding for Spaceflight Applications : Processing and Characterisation

    Author : Kerstin Jonsson; Maaike Visser-Taklo; Uppsala universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Engineering physics; wafer bonding; oxygen plasma; wet chemical; anodic bonding; gamma irradiation; proton irradiation; temperature cycling; vibration; shock; Weibull; adhesion quantification; double cantilever beam; tensile; chevron; blister; Teknisk fysik; Engineering physics; Teknisk fysik;

    Abstract : Bonding techniques intended for assembling space microsystems are studied in this work. One of the largest problems in bonding pre-processed semiconductor wafers are the severe process restrictions imposed by material compatibility issues. READ MORE