Search for dissertations about: "oxygen-plasma"
Showing result 1 - 5 of 20 swedish dissertations containing the word oxygen-plasma.
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1. Oxygen plasma assisted silicon wafer bonding
Abstract : .... READ MORE
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2. Low temperature transfer bonding for MEMS. Utilizing and characterizing oxygen plasma assisted direct wafer bonding
Abstract : Transfer bonding enables the integration of devices, e.g. integrated circuits (ICs) and transducers, fabricated using processes and/or designs that are not compatible with each other as well as double sided micromachining of thin films. READ MORE
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3. Plasma assisted low temperature semiconductor wafer bonding
Abstract : Direct semiconductor wafer bonding has emerged as a technology to meet the demand foradditional flexibility in materials integration. The applications are found in microelectronics, optoelectronics and micromechanics. For instance, wafer bonding is used to produce silicon-on-insulator (SOI) wafers. READ MORE
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4. The RDGT - Integration of Micromechanics and Electronics by Plasma Assisted Wafer Bonding
Abstract : A high-resolution capacitive sensing technique is presented in this thesis: the Resonant Double Gate Transistor (RDGT). The major advantage of the RDGT compared to "pure" capacitive sensing techniques is its low output impedance because of the direct capacitance to current conversion of the transistor. READ MORE
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5. Loss and recovery of hydrophobicity of polydimethylsiloxane after exposure to electrical discharges
Abstract : Silicone rubber based on polydimethylsiloxane is used ashigh voltage outdoor insulation, due to its ability to preservethe hydrophobic surface properties during service and evenregain hydrophobicity after exposure to electrical discharges.The underlying processes for the hydrophobic recovery arediffusion of low molar mass siloxanes from the bulk to thesurface and reorientation by conformational changes ofmolecules in the surface region. READ MORE