Search for dissertations about: "printed circuit boards PCB"

Showing result 1 - 5 of 9 swedish dissertations containing the words printed circuit boards PCB.

2. 1. Computation of EMC Properties of Slots and Printed Circuit Boards

   Author : Jan Carlsson; RISE; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; corrugations; crosstalk; FDTD; spectral domain; EFIE; chokes; Finite Difference Method; printed circuit board; transmission line network; EMC analysis; PCB; transmission line theory; radiated emission; Method of moments; MM; MoM; electric field integral equation; soft and hard surfaces; slot; radiated susceptibility;

   Abstract : This thesis deals with the numerical solution of electromagnetic compatibility (EMC) problems for electronic systems, such as radiated emission, susceptibility and crosstalk on printed circuit boards and transmission through slots. The analysis of printed circuit boards is done by using an electric field integral equation (EFIE) expressed in the frequency domain, which is solved by using the method of moments. READ MORE

4. 2. High Aspect Ratio Microstructures in Flexible Printed Circuit Boards : Process and Applications

   Author : Hanna Yousef; Klas Hjort; Mikael Lindeberg; Peter Leisner; Uppsala universitet; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Engineering physics; flexible printed circuit boards; polyimide; through-hole vias; ion track technology; thermoelectricity; thermopiles; substrate integrated waveguides; millimeter wave devices; Teknisk fysik; Engineering physics; Teknisk fysik;

   Abstract : Flexible printed circuit boards (flex PCBs) are used in a wide range of electronic devices today due to their light weight, bendability, extensive wiring possibilities, and low-cost manufacturing techniques. The general trend in the flex PCB industry is further miniaturization alongside increasing functionality per device and reduced costs. READ MORE

5. 3. Life Cycle Assessment of Paper Based Printed Circuits

   Author : Qiansu Wan; Li-Rong Zheng; Changqing Liu; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Printed Electronics; Environment; PCB; Life Cycle assessment; Emissions; Informations- och kommunikationsteknik; Information and Communication Technology;

   Abstract : Printed circuit boards have been massively manufactured and wildly used in all kinds of electronic devices during people’s daily life for more than thirty years since the last century. As a highly integrated device mainly consists of silicon base, an etched copper layer and other soldered components, massive production of printed circuit boards are considered to be environmentally unfriendly due to the wet chemical manufacturing mode and lack of recycling ability. READ MORE

6. 4. Contactless Test of Circuit Boards

   Author : Abdelghani Renbi; Heli Jantunen; Luleå tekniska universitet; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Industriell elektronik; Industrial Electronics;

   Abstract : Electronics are still continuing to respond to the small-feature size requirement for economical, performance and environmental benefits.Due to the non-idealities in the manufacturing process of circuit boards, electronics production yield is never 100 %. READ MORE

7. 5. Alternative electronic packaging concepts for high frequency electronics

   Author : Wolfgang Peter Siebert; Sture Petersson; Shaofang Gong; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electrical engineering; Connector; cooling; electronic; elastomer interconnect; EMC; shielded enclosure; high frequency; PCB; PWB; reverberation chamber; seams; soldering; twisted pair cable; Elektroteknik; Electrical engineering; Elektroteknik;

   Abstract : The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize the technology of electronic packaging. READ MORE