Search for dissertations about: "sequential build-up"

Showing result 1 - 5 of 10 swedish dissertations containing the words sequential build-up.

  2. 1. High frequency electronic packaging : SBU-materials, material characterization, simulation and processing

    Author : Christian Johansson; Hjalmar Hesselbom; Linköpings universitet; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; dielectric loss; high frequency electrical characterization; microwave circuits; multilayer thin film technology; ORMOCER; permittivity; sequential build up; silicone elastomer;

    Abstract : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both High Density Interconnects (HDI) and high frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. READ MORE

  4. 2. High frequency electronic packaging and components : characterization, simulation, materials and processing

    Author : Christian Johansson; Mats Robertsson; Li-Rong Zheng; Linköpings universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Dielectric loss; high frequency electrical characterization; microwave circuits; multilayer thin film technology; ORMOCER®; permittivity; printed diode; sequential build-up; silicone elastomer; Signal processing; Signalbehandling;

    Abstract : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both high density interconnects and high frequency devices have led to the search for new materials, material combinations, methods, processes and production equipment. READ MORE

  5. 3. Optical interconnects and high frequency electronic packaging : SBU-materials, material characterization, LAP- & microprocessing

    Author : Steffen Uhlig; Linköpings universitet; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; optical interconnects; overview opto coupling components; overview planar waveguide amplifiers; large area panel processing; polymer waveguides; multilayer thin film technology; ORMOCER®; sequential build up; permittivity; dielectric loss;

    Abstract : The main objective of this thesis is to discuss and demonstrate optical interconnect technologies. These can be used to enhance the data throughput capacity of future printed circuit boards and backplanes, i.e. exchange Copper conductors with light conductors. READ MORE

  6. 4. High frequency properties of electrically conductive adhesive interconnections and multilayer substrates

    Author : Markus Dernevik; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; microwaves; sequential build-up board; electrically conductive adhesives; flip-chip; printed cirquit board; anisotropic adhesives; multilayer; interconnections; printed wire board; surface mount technology; isotopic adhesives;

    Abstract : .... READ MORE

  7. 5. Contactless Test of Circuit Boards

    Author : Abdelghani Renbi; Heli Jantunen; Luleå tekniska universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Industriell elektronik; Industrial Electronics;

    Abstract : Electronics are still continuing to respond to the small-feature size requirement for economical, performance and environmental benefits.Due to the non-idealities in the manufacturing process of circuit boards, electronics production yield is never 100 %. READ MORE