Search for dissertations about: "wafer manufacturing"

Showing result 1 - 5 of 19 swedish dissertations containing the words wafer manufacturing.

2. 1. Integration and Fabrication Techniques for 3D Micro- and Nanodevices

   Author : Andreas C. Fischer; Frank Niklaus; Karl F. Böhringer; KTH; []
   Keywords : Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; chip-level; through silicon via; TSV; packaging; 3D packaging; vacuum packaging; liquid encapsulation; integration; heterogeneous integration; wafer bonding; microactuators; shape memory alloy; SMA; wire bonding; magnetic assembly; self-assembly; 3D; 3D printing; focused ion beam; FIB;

   Abstract : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. READ MORE

4. 2. Wafer-level processing of ultralow-loss Si3N4

   Author : Marcello Girardi; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; waveguide; photonic integrated circuit; multilayer integration; ultralow loss; microcombs i; silicon nitride;

   Abstract : Photonic integrated circuits (PICs) are devices fabricated on a planar wafer that allow light generation, processing, and detection. Photonic integration brings important advantages for scaling up the complexity and functionality of photonic systems and facilitates their mass deployment in areas where large volumes and compact solutions are needed, e. READ MORE

5. 3. Integration of Surface Acoustic Wave and Microfluidic Technologies for Liquid-Phase Sensing Applications

   Author : Kiryl Kustanovich; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; IDE; Resonator; SH-SAW; Impedance Spectroscopy; Surface Acoustic Wave; PDMS; LiNbO3; Microfluidics; Sensor;

   Abstract : This thesis discusses a new concept for construction of a novel SAW in-liquid sensor employing surface acoustic wave resonance (SAR) in a one-port configuration. In this concept, the reflective gratings of a one-port SAW resonator are employed as mass loading-sensing elements, while the SAW transducer is protected from the measurement environment, reducing power losses significantly. READ MORE

6. 4. MEMS-based electrochemical gas sensors and wafer-level methods

   Author : Hithesh K Gatty; Göran Stemme; Roxhed Niclas; Anita Lloyd Spetz; KTH; []
   Keywords : MEMS; gas sensors; electrochemical; nitric oxide; hydrogen sulphide; nafion; nano;

   Abstract : This thesis describes novel microel ectromechanical system (MEMS) based electrochemical gas sensors and methods of fabrication.This thesis presents the research in two parts. In the first part, a method to handle a thin silicon wafer using an electrochemically active adhesive is described. READ MORE

7. 5. Crack-junctions : Bridging the gap between nano electronics and giga manufacturing

   Author : Valentin Dubois; Göran Stemme; Christofer Hierold; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; nanotechnology; nanoelectronics; nanogap electrodes; molecular electronics; nanoplasmonics; crack-junctions; break junctions; nanowires; parallel fabrication; lithography; fracture; crack; Electrical Engineering; Elektro- och systemteknik;

   Abstract : Obtaining both nanometer precision of patterning and parallel fabrication on wafer-scale is currently not possible in conventional fabrication schemes. Just as we are looking beyond semiconductor technologies for next-generation electronics and photonics, our efforts turn to new ways of producing electronic and photonic interfaces with the nanoscale. READ MORE