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Showing result 1 - 5 of 18 swedish dissertations matching the above criteria.

  2. 1. Track circuits’ robustness : Modeling, measurement and simulation

    Author : Emilio Rodriguez; Ajit Kumar Verma; Luleå tekniska universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Track circuit; Relay; False positive signals; Signalling in railway; Modelling; Simulation; Testing; Robustness; Interoperability; Reliability; Railway Infrastructure; Drift och underhållsteknik; Operation and Maintenance Engineering;

    Abstract : In countries with rough weather conditions, frequent delays cause railway companies to waste time and money. Many of these delays are related to the train detection systems, as the old DC track circuits are still used in some countries, including Sweden, our case study. READ MORE

  4. 2. Contacts and Interconnects for Germanium-based Monolithic 3D Integrated Circuits

    Author : Lukas Jablonka; Zhen Zhang; Shi-Li Zhang; Fabrice Nemouchi; Uppsala universitet; []
    Keywords : Teknisk fysik med inriktning mot elektronik; Engineering Science with specialization in Electronics;

    Abstract : Three-dimensional integrated circuits have great potential for further increasing the number of transistors per area by stacking several device tiers on top of each other and without the need to continue the evermore complicated and expensive down-scaling of transistor dimensions. Among the different approaches towards the realization of such circuits, the monolithic approach, i. READ MORE

  5. 3. Germanium layer transfer and device fabrication for monolithic 3D integration

    Author : Ahmad Abedin; Mikael Östling; Cor Claeys; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Monolithic; sequential; 3D; silicon; germanium; wafer bonding; etch back; germanium on insulator; GOI; Ge pFET; low temperature; Sipassivation; pn junction; Kisel; germanium; epitaxi; selektiv; pn-övergång; germanium påisolator; GOI; Ge PFET; bonding; monolitisk; sekventiell; tre dimensionell; 3D; lågtemperarad;

    Abstract : Monolithic three-dimensional (M3D) integration, it has been proposed,can overcome the limitations of further circuits’ performance improvementand functionality expansion. The emergence of the internet of things (IoT) isdriving the semiconductor industry toward the fabrication of higher-performancecircuits with diverse functionality. READ MORE

  6. 4. Applications of Si1-xGex alloys for Ge devices and monolithic 3D integration

    Author : Konstantinos Garidis; Per-Erik Hellström; Mikael Östling; Sten Vollebregt; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Silicon; germanium; epitaxy; selective; pn junction; germanium on insulator; GOI; Ge PFET; bonding; monolithic; sequential; three dimensional; 3D; low temperature; Informations- och kommunikationsteknik; Information and Communication Technology;

    Abstract : As the semiconductor industry moves beyond the 10 nm node, power consumption constraints and reduction of the negative impact of parasitic elements become important. Silicon germanium (Si1−xGex) alloys have been used to amplify the performance of Si based devices and integrated circuits (ICs) for decades. READ MORE

  7. 5. Silicon photonic MEMS building blocks for low-power programmable circuits

    Author : Pierre Edinger; Kristinn Gylfason; Frank Niklaus; Sangyoon Han; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Photonics; silicon photonics; MEMS; photonic MEMS; 3D printing; liquid crystals; programmable photonics; phase shifters; optical switches; ring resonators; Electrical Engineering; Elektro- och systemteknik;

    Abstract : Silicon photonics, or the confinement and control of light in integrated silicon waveguides, has rapidly grown from research labs to high-end chips for telecommunications. With the associated improvements in waveguide performance, the technology is promising for a wide range of new applications, from computing to sensing. READ MORE