Search for dissertations about: "Application package"

Showing result 1 - 5 of 66 swedish dissertations containing the words Application package.

  1. 1. Mechanics and Failure in Thin Material Layers : Towards Realistic Package Opening Simulations

    Author : Eskil Andreasson; Sharon Kao-Walter; Gabriella Bolzon; Blekinge Tekniska Högskola; []
    Keywords : ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; aluminium foil; FEM; LDPE; localisation; necking; polymer; progressive damage; semi-crystalline; simulation; virtual twin;

    Abstract : The final goal of this PhD-work is an efficient and user-friendly finite element modelling strategy targeting an industrial available package opening application.  In order to reach this goal, different experimental mechanical and fracture mechanical tests were continuously refined to characterize the studied materials. READ MORE

  2. 2. The development and implementation of software for palaeoenvironmental and palaeoclimatological research : the Bugs Coleopteran Ecology Package (BugsCEP)

    Author : Philip Buckland; Roger Engelmark; Geoffrey Lemdahl; Paul Sinclair; Umeå universitet; []
    Keywords : HUMANITIES; HUMANIORA; HUMANIORA; HUMANITIES; Quaternary geology; environmental archaeology; quaternary science; Coleoptera; beetles; database; environmental reconstructions; climate reconstructions; software; Mutual Climatic Range; MCR; palaeoentomology; Kvartärgeologi; Archaeology; Arkeologi; Archaeology; arkeologi;

    Abstract : This thesis documents the development and application of a unique database orientated software package, BugsCEP, for environmental and climatic reconstruction from fossil beetle (Coleoptera) assemblages. The software tools are described, and the incorporated statistical methods discussed and evaluated with respect to both published modern and fossil data, as well as the author’s own investigations. READ MORE

  3. 3. Intelligent and Interactive Package Based on RFID and WSN

    Author : Jie Gao; Li-Rong Zheng; Richard Uusijärvi; KTH; []
    Keywords : ;

    Abstract :    An intelligent and interactive package can interact with people smartly, safely and friendly. It involves many technologies such as electronics, optics, biologic, magnetics and electro-mechanics. READ MORE

  4. 4. Electrochemical machining: towards 3D simulation and application on SS316

    Author : A. A. Gomez-Gallegos; UK University of Edinburgh; []
    Keywords : ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; electrochemical machining; 3D Simulation; FEM; stainless Steel 316; surface Finish; Maskinteknik; Mechanical Engineering;

    Abstract : Electrochemical machining (ECM) is a non-conventional manufacturing process, which uses electrochemical dissolution to shape any conductive metal regardless of its mechanical properties and without leaving behind residual stresses or tool wear. Therefore, ECM can be an alternative for machining difficult-to-cut materials, complex geometries, and materials with improved characteristics, such as strength, heat-resistance or corrosion-resistance. READ MORE

  5. 5. Process development and Reliability Study for System-in-a-Package by using a Liquid Crystal Polymer Substrate

    Author : Liu Chen; Chalmers University of Technology; []
    Keywords : and Adhesion; Finite Element Simulation; Embedded Active and Passives Technology; System-in-a-Package; Liquid Crystal Polymer; Electroless Copper Plating;

    Abstract : System-in-a-package (SiP) aims to integrate all of the system functions within a system-level package, containing multiple ICs and other components interconnected through a high-density substrate. SiP is characterized by dividing chip functions among several smaller chips, by connecting chips in the first stage of board manufacture, and by integrating passive components in the substrate. READ MORE