Search for dissertations about: "Atomic Layer Epitaxy"
Showing result 1 - 5 of 25 swedish dissertations containing the words Atomic Layer Epitaxy.
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1. Atomic layer epitaxy of copper
Abstract : The high electric and thermal conductivity of copper has made it to a prime candidate as interconnect material in future integrated circuits. In this thesis, Atomic Layer Epitaxy has been used to deposit thin copper films on a variety of substrates, using both CuCl and Cu(II)2,2,6,6-tetramethyl-3,5-heptanedionate, Cu(thd)2, as precursors and hydrogen as reducing agent. READ MORE
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2. Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates
Abstract : Thin films play an important role in science and technology today. By combining different materials, properties for specific applications can be optimised. READ MORE
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3. Molecular beam epitaxy growth and characterization of GaN, AlN and AlGaN/GaN heterostructures
Abstract : The III-nitride materials, consisting of Al, Ga, In and N, have several physical properties that make them attractive for semiconductor devices in electronic and optic applications. A wide range of direct energy bandgaps (0.7 eV - 6.1 eV) can be obtained. READ MORE
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4. Thin Film Synthesis of Nickel Containing Compounds
Abstract : Most electrical, magnetic or optical devices are today based on several, usually extremely thin layers of different materials. In this thesis chemical synthesis processes have been developed for growth of less stable and metastable layers, and even multilayers, of nickel containing compounds. READ MORE
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5. Epitaxy and characterization of SiGeC layers grown by reduced pressure chemical vapor deposition
Abstract : Heteroepitaxial SiGeC layers have attracted immenseattention as a material for high frequency devices duringrecent years. The unique properties of integrating carbon inSiGe are the additional freedom for strain and bandgapengineering as well as allowing more aggressive device designdue to the potential for increased thermal budget duringprocessing. READ MORE