Search for dissertations about: "BCB"

Showing result 1 - 5 of 9 swedish dissertations containing the word BCB.

  1. 1. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

    Author : Niklaus Frank; KTH; []
    Keywords : adhesive; wafer; bonding; low temperature; CMOS compatible; selective; local; polymer; thermoplastic; thermosetting; intermediate layer; coating; benzocyclobutene; BCB; photoresist; epoxy; glue; wafer-level; sacrificial; etching; grinding; etch-stop;

    Abstract : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. READ MORE

  2. 2. Assembly of microsystems for optical and fluidic applications

    Author : Sjoerd Haasl; Göran Stemme; Richard Syms; KTH; []
    Keywords : ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; Applied mechanics; microsystem technology; micromachining; assembly; active alignment; BCB; Teknisk mekanik; Engineering mechanics; Teknisk mekanik;

    Abstract : This thesis addresses assembly issues encountered in optical and fluidic microsystem applications. In optics, the first subject concerns the active alignment of components in optical fibersystems. READ MORE

  3. 3. Fabrication and characterization of HFET based MMICs for millimeterwave applications

    Author : Christer Karlsson; Chalmers University of Technology; []
    Keywords : InAs; microwave; millimeterwave; resistive mixer; BCB; balanced doubler; HFET; III-V semiconductor; MMIC;

    Abstract : .... READ MORE

  4. 4. Integrated Variable-Gain and CMOS Millimeter-Wave Amplifiers

    Author : Mohammad Anowar Masud; Chalmers University of Technology; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; LNA; MMIC; FinFET; CMOS; HEMT; GaAs; WLP; VGA; BCB;

    Abstract : Variable Gain Amplifier finds extensive use in the high frequency demonstrators specially those operating in the millimeter-wave regions and beyond where the incoming RF signal level can have wide variations. To maintain a constant signal level an IF VGA has been designed that can offer a dynamic variation of gain as much as 45 dB together with a high maximum gain and a low noise figure. READ MORE

  5. 5. Novel RF MEMS Switch and Packaging Concepts

    Author : Joachim Oberhammer; KTH; []
    Keywords : 0-level packaging; adhesive bonding; BCB; benzocyclobutene; bond strength; contact printing; film actuator; glass lid encapsulation; glass lid packaging; helium leak test; hermetic packaging; hermeticity; high isolation switch; low stress silicon nitride; low volt; TECHNOLOGY; TEKNIKVETENSKAP;

    Abstract : Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to switch, modulate, filter or tune electrical signals from DC to microwave frequencies. The micromachining techniques used to fabricate these components are based on the standard clean-room manufacturing processes for high-volume integrated semiconductor circuits. READ MORE