Search for dissertations about: "Bonding"

Showing result 6 - 10 of 596 swedish dissertations containing the word Bonding.

  2. 6. Towards Unconventional Applications of Wire Bonding

    Author : Stephan Schröder; Frank Niklaus; Michael Mayer; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; wire bonding; wire integration; transfer wafer bonding; nondispersive infrared gas sensing; low-stress packaging; shape memory alloy SMA ; infrared IR emitter; through silicon via TSV ; ethanol sensing; nitric oxide gas sensing; wafer-level; chip-level; Kanthal; nickel chromium NiCr ; Electrical Engineering; Elektro- och systemteknik;

    Abstract : This thesis presents novel heterogeneous integration approaches of wire materials to fabricated and package MEMS devices by exploring unconventional applications of wire bonding technology. Wire bonding, traditionally endemic in the realm of device packaging to establish electrical die-to-package interconnections, is an attractive back-end technology, offering promising features, such as high throughput, flexibility and placement accuracy. READ MORE

  4. 7. The RDGT - Integration of Micromechanics and Electronics by Plasma Assisted Wafer Bonding

    Author : Anke Sanz-Velasco; Chalmers tekniska högskola; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; bonding; displacement measurement; oxygen plasma; low temperature wafer bonding; capacitive detection; high resolution; CMOS compatibility; MOSFET; low impedance sensing; resonant gate transistor;

    Abstract : A high-resolution capacitive sensing technique is presented in this thesis: the Resonant Double Gate Transistor (RDGT). The major advantage of the RDGT compared to "pure" capacitive sensing techniques is its low output impedance because of the direct capacitance to current conversion of the transistor. READ MORE

  5. 8. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

    Author : Niklaus Frank; KTH; []
    Keywords : adhesive; wafer; bonding; low temperature; CMOS compatible; selective; local; polymer; thermoplastic; thermosetting; intermediate layer; coating; benzocyclobutene; BCB; photoresist; epoxy; glue; wafer-level; sacrificial; etching; grinding; etch-stop;

    Abstract : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. READ MORE

  6. 9. Bonding and Desorption Mechanismsof CO on Metal Surfaces

    Author : Jörgen Gladh; Henrik Öström; Mats Götelid; Stockholms universitet; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; Bonding; Desorption; CO; Metal; kemisk fysik; Chemical Physics; fysik; Physics;

    Abstract : I have investigated two different systems CO/Fe(100) and CO/Ru(0001), toobtain new information on the binding and desorption processes. The twodifferent systems have served as a model system, one for a static examination,CO on iron, and for the dynamic case, CO on ruthenium. READ MORE

  7. 10. Bonding Ability Distribution of Fibers in Mechanical Pulp Furnishes

    Author : Sofia Reyier; Per Engstrand; Hans Höglund; Olof Ferritsius; Hans Ersson; Rita Ferritsius; Philip Reme; Mittuniversitetet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Fiber; mechanical pulp; bonding ability; fiber characterization; Bonding Indicator; BIN; acoustic emission; hydrocyclone; Fiberlab; collapse resistance; fibrillation; Fiber; mekanisk massa; bindningsförmåga; fiber karakterisering; Bindnings Indikator; BIN; akustisk emission; hydrocyklon; Fiberlab; kollaps resistans; fibrillering; Cellulose and paper engineering; Cellulosa- och pappersteknik;

    Abstract : This thesis presents a method of measuring the distribution of fiber bonding ability in mechanical pulp furnishes. The method is intended for industrial use, where today only average values are used to describe fiber bonding ability, despite the differences in morphology of the fibers entering the mill. READ MORE