Search for dissertations about: "Composite Particles"

Showing result 6 - 10 of 150 swedish dissertations containing the words Composite Particles.

  2. 6. Multifunctional Nanocellulose Composite Materials

    Author : Olof Eskilson; Daniel Aili; Robert Selegård; Erik Martinsson; Aji Mathew; Linköpings universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; nanomaterials; nanocomposites; bacterial cellulose; wound care; plasmonics; catalysis;

    Abstract : Nanoparticles (NPs) are particles with more than one dimension between 1 and 100 nm. Because of their small size, they typically display different physical and chemical properties than the corresponding bulk materials. NPs have been used in many different applications, such as in electronics, optics, catalysis, and in biomedicine. READ MORE

  4. 7. The Role of Microstructure in the Atmospheric Corrosion of Selected Light Alloys and Composites

    Author : Mohsen Esmaily; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; galvanic corrosion; Al content; microstructure; intermetallic particles; atmospheric corrosion; Al alloy 6xxx; casting; Mg-Al alloys; FSW P; BFSW.; Mg alloys-based MMCs;

    Abstract : Magnesium-aluminum (Mg-Al) alloys, Mg-based metal matrix composites (MMCs) and Al alloys are among the best material candidates for future lightweight solutions. However, the use of these materials is limited by a number of issues, including the ability to resist corrosion. READ MORE

  5. 8. Solder Matrix Fiber Composite Thermal Interface Materials

    Author : Josef Hansson; Chalmers tekniska högskola; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; thermal management; composite materials; solder; thermal interface material;

    Abstract : Overheating has been a problem for microelectronics devices for decades, and the problem is exacerbated by the continued trend of miniaturization of features and the corresponding increase in power density. Thermal interface materials (TIMs) target one of the main bottlenecks in heat transfer: the interface between two materials, such as between a heat-generating microchip and a heatsink. READ MORE

  6. 9. On Surface Characteristics and Microstructural Development of Soft Magnetic Composite Powder and Components

    Author : Christos Oikonomou; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; X-ray photoelectron spectroscopy; compaction; annealing; X-ray diffraction; soft magnetic composites; high resolution scanning electron microscopy; surface layers; magnetic testing; powder metallurgy; depth profiling; electron backscatter diffraction; focused ion beam; thickness determination; energy dispersive X-ray spectroscopy; microstructure;

    Abstract : Soft Magnetic Composite (SMC) products manufactured by traditional Powder Metallurgical (PM) techniques, are strong candidate materials for electromagnetic applications. Their advantages are based on cost and energy efficient production methods, shape complexity realization and uniquely uniform and isotropic three dimensional (3D) magnetic properties. READ MORE

  7. 10. Characterization of nano-scale materials for interconnect and thermal dissipation application in electronics packaging

    Author : Xin Luo; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; thermal conductivity; thermal interface material; thermal management; boron nitride fiber; electrospun nanofiber; lead-free solder; carbon fiber; nano-scale oxide layer; metal matrix composite;

    Abstract : This thesis focuses on studies of nano-scale materials in electronic packaging applications with respect to following aspects: surface analysis of nano-scale oxide of lead-free solder particles, and thermal performance and mechanical property studies of nano-scale fiber and metal composite-based thermal interface materials. The composition and thickness of the solder oxide have a direct impact on the quality of interconnects and the reliability of a packaged system. READ MORE