Search for dissertations about: "Electronics related thesis"

Showing result 1 - 5 of 173 swedish dissertations containing the words Electronics related thesis.

2. 1. Metal Films for Printed Electronics : Ink-substrate Interactions and Sintering

   Author : Thomas Öhlund; Håkan Olin; Hans-Erik Nilsson; Mattias Andersson; Patrick Gane; Mittuniversitetet; []
   Keywords : NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; inkjet printing; silver nanoparticles; paper; flexible substrates; sintering; printed electronics; IPL sintering; flash sintering; copper films; coatings; thin films; AgNP; conductive films; metal films;

   Abstract : A new manufacturing paradigm may lower the cost and environmental impact of existing products, as well as enable completely new products. Large scale, roll-to-roll manufacturing of flexible electronics and other functionality has great potential. READ MORE

4. 2. Wearable Pedobarography System for Monitoring of Walk Related Parameters

   Author : Per Anders Rickard Hellström; Mia Folke; Martin Ekström; Ning Xiong; Helena Grip; Mälardalens högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; elektronik; Electronics;

   Abstract : Health care costs have increased over the last decades due to an ageing population. Therefore, research in personal health monitoring (PHM) has increased in response to this. READ MORE

5. 3. Low-Power Multi-GHz Circuit Techniques for On-chip Clocking

   Author : Martin Hansson; Atila Alvandpour; Per Larsson-Edefors; Linköpings universitet; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; CMOS; low-power; high-performance; flip-flop; clocking; leakage-compensation; process-variation; Electronics; Elektronik;

   Abstract : The impressive evolution of modern high-performance microprocessors have resulted in chips with over one billion transistors as well as multi-GHz clock frequencies. As the silicon integrated circuit industry moves further into the nanometer regime, three of the main challenges to overcome in order for continuing CMOS technology scaling are; growing standby power dissipation, increasing variations in process parameters, and increasing power dissipation due to growing clock load and circuit complexity. READ MORE

6. 4. Flip chip for high frequency applications : materials aspects

   Author : Katarina Boustedt; Dag Stranneby; Rao Tummala; Örebro universitet; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Flip chip; underfill; bumping; microwave; gallium arsenide; high frequency; thermocompression; soldering; stud bumps; coplanar waveguide; Electrical engineering; electronics and photonics; Elektroteknik; elektronik och fotonik; Elektronik; Electronics;

   Abstract : Flip chip has since decades been the primary choice for chip interconnect for high performance circuits. Over the last few years, interest from the microwave arena has increased, and at this point in time microwave flip chip is a possible option for volume production. READ MORE

7. 5. Capacitance transient measurements on point defects in silicon and silicol carbide

   Author : Hanne Kortegaard Nielsen; Anders Hallén; F. Damie Auret; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electronics; Elektronik; Electronics; Elektronik;

   Abstract : Electrically active point defects in semiconductor materials are important because they strongly affect material properties like effective doping concentration and charge carrier lifetimes. This thesis presents results on point defects introduced by ion implantation in silicon and silicon carbide. READ MORE