Search for dissertations about: "Epoxy adhesive"

Showing result 1 - 5 of 17 swedish dissertations containing the words Epoxy adhesive.

  2. 1. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

    Author : Niklaus Frank; KTH; []
    Keywords : adhesive; wafer; bonding; low temperature; CMOS compatible; selective; local; polymer; thermoplastic; thermosetting; intermediate layer; coating; benzocyclobutene; BCB; photoresist; epoxy; glue; wafer-level; sacrificial; etching; grinding; etch-stop;

    Abstract : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. READ MORE

  4. 2. Mechanical behaviour of adhesive layers : experimental methods, cohesive laws, and fracture mechanics

    Author : Anders Biel; Kristofer Gamstedt; Högskolan i Skövde; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; experimental method; adhesive layer; cohesive law; fracture; fracture energy; energy release rate; peel; shear; Materials science; Teknisk materialvetenskap; Teknik; Technology;

    Abstract : Adhesive joining is today viewed as one of the key technologies to achieve decreased emissions in the automobile industry. To decrease weight, optimal material selection often results in different materials for different parts. This leads to the necessity to join mixed material. Here, the use of adhesives is the most promising joining technology. READ MORE

  5. 3. Cohesive modelling of the temperature dependence of epoxy based adhesives in Mode I and Mode II loading

    Author : Tomas Walander; Ulf Stigh; Anders Biel; Erik Serrano; Högskolan i Skövde; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Cohesive laws; Epoxy adhesive; Fracture energy; Peak stress; Temperature; Regression analyses; Shear modulus; Young’s modulus.; Technology; Teknik;

    Abstract : In this work, the influence of the temperature on the cohesive laws for two epoxy adhesives is studied at temperatures below the glass transition temperature for both Mode I and Mode II loading. Cohesive laws are measured experimentally under quasi-static loading conditions in the temperature range -30≤T≤80"C" . READ MORE

  6. 4. Condition monitoring of process equipment made from plastic materials

    Author : Bjarne Moursund; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; GRE; glass fibre reinforced epoxy; piping; adhesive; acoustic emission; joints; fatigue life; ultrasonic inspection; water hammer;

    Abstract : .... READ MORE

  7. 5. Meso-Mechanical Modeling of Thin Adhesive Layers

    Author : Kent Salomonsson; Högskolan i Skövde; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; adhesive layer; meso-mechanical; FEM; RVE; SEM; Engineering mechanics; Teknisk mekanik; Technology; Teknik;

    Abstract : A thin adhesive layer is analyzed using a representative volume element (RVE). The RVE is comprised by, both continuum and interfacial finite elements. The interface elements allow for crack initiation and crack propagation. To obtain realistic results from the RVE simulation, an in situ scanning electron microscopy (SEM) study is performed. READ MORE