Search for dissertations about: "FEM simulation for mechanical properties"
Showing result 1 - 5 of 34 swedish dissertations containing the words FEM simulation for mechanical properties.
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1. Electrochemical machining: towards 3D simulation and application on SS316
Abstract : Electrochemical machining (ECM) is a non-conventional manufacturing process, which uses electrochemical dissolution to shape any conductive metal regardless of its mechanical properties and without leaving behind residual stresses or tool wear. Therefore, ECM can be an alternative for machining difficult-to-cut materials, complex geometries, and materials with improved characteristics, such as strength, heat-resistance or corrosion-resistance. READ MORE
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2. Mechanics and Failure in Thin Material Layers : Towards Realistic Package Opening Simulations
Abstract : The final goal of this PhD-work is an efficient and user-friendly finite element modelling strategy targeting an industrial available package opening application. In order to reach this goal, different experimental mechanical and fracture mechanical tests were continuously refined to characterize the studied materials. READ MORE
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3. Branch Identification in Elastic Stability Analysis
Abstract : In this thesis, methods to determine the static postbuckling behaviour of elastic structures undergoing large deformations, are considered and developed. Since the governing non-linear equations usually becomes too complex to be handled analytically, the main focus has been on developing methods that can be incorporated into a numerical solution scheme, such as the finite element method. READ MORE
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4. Development of Accurate Reduced Order Models in a Simulation Tool for Turbomachinery Aeromechanical Phenomena
Abstract : Modern gas turbines are still vulnerable to vibrations when operated at certain speeds. This unstable environment can lead to high cycle fatigue (HCF) and damage several of the components inside the turbine. READ MORE
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5. System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate
Abstract : System-in-a-Package (SiP) is one of the most advanced approaches to meet the requirements for future high-density electronics packaging. In this thesis, a 3D system-in-a-package concept with embedded active and passive components is proposed, where a liquid crystal polymer (LCP) was used as the base substrate. READ MORE