Search for dissertations about: "Göran Stemme"
Showing result 1 - 5 of 22 swedish dissertations containing the words Göran Stemme.
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1. Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor
Abstract : This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. READ MORE
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2. Wafer-level heterogeneous integration of MEMS actuators
Abstract : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. READ MORE
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3. Integration and Packaging Concepts for Infrared Bolometer Arrays
Abstract : Infrared (IR) imaging devices based on energy detection has shown a dramatic development in technology along with an impressive price reduction in recent years. However, for a low-end market as in automotive applications, the present cost of IR cameras is still the main obstacle to broadening their usage. READ MORE
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4. Crack-junctions : Bridging the gap between nano electronics and giga manufacturing
Abstract : Obtaining both nanometer precision of patterning and parallel fabrication on wafer-scale is currently not possible in conventional fabrication schemes. Just as we are looking beyond semiconductor technologies for next-generation electronics and photonics, our efforts turn to new ways of producing electronic and photonic interfaces with the nanoscale. READ MORE
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5. Bright Lights: Innovative Micro- and Nano-Patterning for Sensing and Tissue Engineering
Abstract : Light is the primary source of energy on our planet and has been a significant driver in the evolution of human society and technology. Light finds applications in two-dimensional (2D) photolithography and three-dimensional (3D) printing, where a pattern is transferred to a material of interest by ultraviolet (UV) light exposure, and in laser scribing and cutting, where high power lasers are used to pattern the surface of objects or cut through the bulk of the material of interest. READ MORE