Search for dissertations about: "Göran Stemme"

Showing result 1 - 5 of 22 swedish dissertations containing the words Göran Stemme.

2. 1. Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor

   Author : Mikael Antelius; Göran Stemme; Yogesh B. Gianchandani; KTH; []
   Keywords : Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; packaging; vacuum packaging; liquid encapsulation; integration; wire bonding; grating coupler; waveguide; Fabry-Perot resonator;

   Abstract : This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. READ MORE

4. 2. Wafer-level heterogeneous integration of MEMS actuators

   Author : Stefan Braun; Göran Stemme; Martin A. Schmidt; KTH; []
   Keywords : NATURVETENSKAP; NATURAL SCIENCES; Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; transfer integration; packaging; assembly; wafer bonding; adhesive bonding; eutectic bonding; release etching; electrochemical etching; microvalves; microactuator; Shape Memory Alloy; SMA; NITINOL; TiNi; NiTi; cold-state reset; bias spring; stress layers; crossbar switch; routing; switch; switch array; electrostatic actuator; S-shaped actuator; zipper actuator; addressing; transfer stamping; blue tape; Computer engineering; Datorteknik;

   Abstract : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. READ MORE

5. 3. Integration and Packaging Concepts for Infrared Bolometer Arrays

   Author : Adit Decharat; Göran Stemme; Sjoerd Haasl; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Fabrication; Bonding; packaging; microbolometer; Thermal imaging.; Other electrical engineering; electronics and photonics; Övrig elektroteknik; elektronik och fotonik;

   Abstract :   Infrared (IR) imaging devices based on energy detection has shown a dramatic development in technology along with an impressive price reduction in recent years. However, for a low-end market as in automotive applications, the present cost of IR cameras is still the main obstacle to broadening their usage. READ MORE

6. 4. Crack-junctions : Bridging the gap between nano electronics and giga manufacturing

   Author : Valentin Dubois; Göran Stemme; Christofer Hierold; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; nanotechnology; nanoelectronics; nanogap electrodes; molecular electronics; nanoplasmonics; crack-junctions; break junctions; nanowires; parallel fabrication; lithography; fracture; crack; Electrical Engineering; Elektro- och systemteknik;

   Abstract : Obtaining both nanometer precision of patterning and parallel fabrication on wafer-scale is currently not possible in conventional fabrication schemes. Just as we are looking beyond semiconductor technologies for next-generation electronics and photonics, our efforts turn to new ways of producing electronic and photonic interfaces with the nanoscale. READ MORE

7. 5. Bright Lights: Innovative Micro- and Nano-Patterning for Sensing and Tissue Engineering

   Author : Alessandro Enrico; Göran Stemme; Frank Niklaus; Anna Herland; Jürgen Brugger; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Micro-electromechanical systems MEMS ; nanotechnology; nanowires; microfabrication; tissue engineering; crack-lithography; direct writing; femtosecond lasers; two-photon polymerization; 3D micromachining; cavitation molding; scalable optical patterning; 2D materials; surface structuring; bacterial-surface interaction.; Electrical Engineering; Elektro- och systemteknik;

   Abstract : Light is the primary source of energy on our planet and has been a significant driver in the evolution of human society and technology. Light finds applications in two-dimensional (2D) photolithography and three-dimensional (3D) printing, where a pattern is transferred to a material of interest by ultraviolet (UV) light exposure, and in laser scribing and cutting, where high power lasers are used to pattern the surface of objects or cut through the bulk of the material of interest. READ MORE