Search for dissertations about: "Heat flow"
Showing result 16 - 20 of 643 swedish dissertations containing the words Heat flow.
-
16. Flow and heat transfer in a turbocharger radial turbine
Abstract : In the past decades, stricter legislation has been imposed to improve fuel economy and to reduce tail-end emissions of automotive vehicles worldwide. One of the important and effective technologies adopted by the automobile manufacturers to fulfill legislation requirements is the turbocharger technology. READ MORE
-
17. Thermal and Hydraulic Performance of Enhanced Rectangular Tubes for Compact Heat Exchangers
Abstract : The thermal and hydraulic performance of rib-roughened, dimpled and offset strip fin tubes has been investigated experimentally. Results from measurements on commercially manufactured tubes have shown that rib-roughened tubes have best potential for heat transfer enhancement with moderate pressure drop increase. READ MORE
-
18. Estimation of Thermal and Hydraulic Characteristics of Compact Brazed Plate Heat Exchangers
Abstract : This thesis work presents various performance estimation methods of compact brazed plate heat exchangers (BPHE) operating in single phase, condenser, evaporator, cascaded and transcritical applications. Such methods play a vital role in development of heat exchanger selection software and during geometry parameter estimation in the new product development process. READ MORE
-
19. Flow Boiling Heat Transfer and Pressure Drop. Experiments and Model Development for Complex Geometries
Abstract : Two very different evaporator geometries, a dimple plate and a herringbone microfin tube, have been studied. Heat transfer and pressure drop for both pure refrigerants and refrigerant mixtures have been determined experimentally. READ MORE
-
20. Turbulent Forced Convection Air Cooling of Electronics with Heat Sinks Under Flow Bypass Conditions
Abstract : Air cooling is still the dominant method for dissipating theheat produced by electronic components. In a typical electronicdevice, the components are situated on a Printed Circuit Board(PCB). For most applications natural convection is sufficientto cool the components. READ MORE