Search for dissertations about: "InP on SOI"
Showing result 1 - 5 of 6 swedish dissertations containing the words InP on SOI.
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1. Silicon micromachined waveguide components for terahertz systems
Abstract : This thesis presents silicon micromachined waveguide components for sub-terahertz and terahertz (THz) systems fabricated by deep reactive ion etching (DRIE). Historically the main driving force for the development of THz systems has been space-based scientific instruments for astrophysics, planetary and Earth science missions. READ MORE
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2. Plasma assisted low temperature semiconductor wafer bonding
Abstract : Direct semiconductor wafer bonding has emerged as a technology to meet the demand foradditional flexibility in materials integration. The applications are found in microelectronics, optoelectronics and micromechanics. For instance, wafer bonding is used to produce silicon-on-insulator (SOI) wafers. READ MORE
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3. Advanced patterning and processing for III-V nanowire device fabrication
Abstract : Semiconductor nanowires are widely considered as promising candidates for next generations of electronics and optoelectronics. Gold seed particles have so far been recognized as the most important catalyst for growth of nanowires. READ MORE
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4. Compound semiconductor materials and processing technologies for photonic devices and photonics integration
Abstract : The advancement of semiconductor optoelectronics relies extensively on materials and processing technologies of ever-increasing sophistication, such as nanometer-range lithography, epitaxial growth methods with monatomic layer control, and anisotropic etching procedures that allows for the precise sculpturing of device features even in the limit of extreme aspect ratios. However, upcoming application needs puts requirements on optimized designs or device performances, e. READ MORE
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5. Design, Simulation and Characterization of Some Planar Lightwave Circuits
Abstract : Optical devices based on planar lightwave circuit (PLC) technology have the advantages of small size, high reliability, possibility for large scale production, and potential integration with electronics. These devices are widely employed in optical telecommunications, sensing, data storage, imaging, and signal processing. READ MORE