Search for dissertations about: "Interconnects"

Showing result 1 - 5 of 69 swedish dissertations containing the word Interconnects.

  1. 1. Non-galvanic Interconnects for Millimeter-wave Systems

    University dissertation from ; Chalmers tekniska högskola; Gothenburg

    Author : Ahmed Adel Hassona; [2018]
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; MMIC; THz; CMOS; taper; InP; LTSA; millimeter-wave; slot antenna; waveguide transition; SiC; GaAs; eWLB; finline; WR-6.5.; interconnects; D-band;

    Abstract : Fueled by the increasing demand for higher data rates, millimeter-wave (mmW) systems emerged as a candidate that can provide multi-gigabit per second (Gb/s) transmission. This demand is mainly driven by modern communication systems and several other wireless and sensing applications such as production quality inspection and imaging systems. READ MORE

  2. 2. Carbon nanomaterial-based interconnects, integrated capacitors and supercapacitors

    University dissertation from ; Chalmers tekniska högskola; Gothenburg

    Author : Muhammad Amin; [2017]
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; carbon nanotubes; Integrated capacitors; vertically aligned carbon nanofibers; Interconnects; PECVD; Interdigitated micro-supercapacitors;

    Abstract : The constant miniaturization and steady performance improvement of electronics devices have generated innovative ideas such as internet of thing (IoT), which also includes devices with integrated energy sources. The high performance is conceived by the high density of the devices on a chip leading to a high density of interconnects, to connect these devices to outside world. READ MORE

  3. 3. Efficient high-speed on-chip global interconnects

    University dissertation from Institutionen för systemteknik

    Author : Peter Caputa; Linköpings universitet.; Linköpings universitet.; [2006]
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Microelectronics; Global Interconnects; On-Chip Interconnects; Velocity-of-Light Delay; On-Chip Communication; Low-Latency; Transmission Lines; TECHNOLOGY Electrical engineering; electronics and photonics Electronics; TEKNIKVETENSKAP Elektroteknik; elektronik och fotonik Elektronik;

    Abstract : The continuous miniaturization of integrated circuits has opened the path towards System-on-Chip realizations. Process shrinking into the nanometer regime improves transistor performancewhile the delay of global interconnects, connecting circuit blocks separated by a long distance, significantly increases. READ MORE

  4. 4. Coated Ferritic Stainless Steels as Interconnects in Solid Oxide Fuel Cells - Material Development and Electrical Properties

    University dissertation from Institutionen för systemteknik

    Author : Jan Gustav Grolig; [2015]
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; SOFC; High Temperature Corrosion; ASR; Interconnects;

    Abstract : Solid oxide fuel cells (SOFCs) are attracting increasing interest as devices with potentialuses in decentralized and clean electricity and heat production. Several challengeswith respect to materials have to be overcome to achieve efficiencies and life-spansthat are sufficient for long-term applications. READ MORE

  5. 5. Optical interconnects and high frequency electronic packaging : SBU-materials, material characterization, LAP- & microprocessing

    University dissertation from Linköping : Linköpings universitet

    Author : Steffen Uhlig; Linköpings universitet.; Linköpings universitet.; [2003]
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; optical interconnects; overview opto coupling components; overview planar waveguide amplifiers; large area panel processing; polymer waveguides; multilayer thin film technology; ORMOCER®; sequential build up; permittivity; dielectric loss;

    Abstract : The main objective of this thesis is to discuss and demonstrate optical interconnect technologies. These can be used to enhance the data throughput capacity of future printed circuit boards and backplanes, i.e. exchange Copper conductors with light conductors. READ MORE