Search for dissertations about: "Layer"
Showing result 6 - 10 of 3243 swedish dissertations containing the word Layer.
-
6. Experimental study on turbulent boundary-layer flows with wall transpiration
Abstract : Wall transpiration, in the form of wall-normal suction or blowing through a permeable wall, is a relatively simple and effective technique to control the behaviour of a boundary layer. For its potential applications for laminar-turbulent transition and separation delay (suction) or for turbulent drag reduction and thermal protection (blowing), wall transpiration has over the past decades been the topic of a significant amount of studies. READ MORE
-
7. Mechanical Behaviour of Single-Layer Adhesive Joints : an integrated approach
Abstract : Innovative products that are competitive on the market are likely to employ newtypes of materials and unusual geometries. A method that can assemble dissimilarmaterials and irregular geometries cost-effectively and at the same time offera joint that is light in weight and imperceptible, is optimal. READ MORE
-
8. Protein and polyelectrolyte layer-by-layer films: Assembly and electron transfer
Abstract : A layer-by-layer deposition technique for assembly of the three-dimensional bioelectrochemical systems, with potential applications such as sensing layers in biosensors or catalytic organisations in biofuel cells, was addressed in this thesis. Several investigations were carried out to understand and control multilayer films formation on planar surfaces, using electrochemical and ellipsometrical methods. READ MORE
-
9. Interfacial Properties of Film Forming Proteins and their Layer-by-Layer Assembly with Nanoparticles
Abstract : The aim of this thesis work was to investigate the interfacial properties of film forming proteins, stability of the layers created by them, and their interactions with nanoparticles. Mussel adhesive protein (Mefp-1) and hydrophobins (HFBI and HFBII) were the three main proteins used. READ MORE
-
10. Atomic layer epitaxy of copper
Abstract : The high electric and thermal conductivity of copper has made it to a prime candidate as interconnect material in future integrated circuits. In this thesis, Atomic Layer Epitaxy has been used to deposit thin copper films on a variety of substrates, using both CuCl and Cu(II)2,2,6,6-tetramethyl-3,5-heptanedionate, Cu(thd)2, as precursors and hydrogen as reducing agent. READ MORE