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Found 1 swedish dissertation matching the above criteria.
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1. Wafer-level 3-D CMOS Integration of Very-large-scale Silicon Micromirror Arrays and Room-temperature Wafer-level Packaging
Abstract : This thesis describes the development of wafer-level fabrication and packaging methods for micro-electromechanical (MEMS) devices, based on wafer-bonding.The first part of the thesis is addressing the development of a wafer-level technology that allows the use of high performance materials, such as monocrystalline silicon, for MEMS devices that are closely integrated on top of sensitive integrated circuits substrates. READ MORE
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