Search for dissertations about: "Micro-electromechanical systems MEMS"
Showing result 1 - 5 of 10 swedish dissertations containing the words Micro-electromechanical systems MEMS.
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1. Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems
Abstract : Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. READ MORE
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2. Integration of graphene into MEMS and NEMS for sensing applications
Abstract : This thesis presents a novel approach to integrate chemical vapor deposition (CVD) graphene into silicon micro- and nanoelectromechanical systems (MEMS/NEMS) to fabricate different graphene based MEMS/NEMS structures and explore mechanical properties of graphene as well as their applications such as acceleration sensing, humidity sensing and CO2 sensing. The thesis also presents a novel method of characterization of CVD graphene grain boundary based defects. READ MORE
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3. MM-wave integrated RF-MEMS tunable cavity resonators, filters and ultra-low phase-noise oscillators
Abstract : Within the Microelectronics Industry, the core research is focused on the realization of the Moore's law, which states that circuit density doubles every 24 months, shaping the framework of the More of Moore paradigm. However, Moore's law is expected to end, as devices are reaching limitations inherent to the approach of the atomical dimensions. READ MORE
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4. Advancing portable, aqueous drug delivery to the human lung
Abstract : Lung disease profoundly impacts human health: many lung diseases are currently without cure and require continued treatment. Due to their ease of use and integration into the daily routine, portable inhalers are the preferred treatment option for patients. READ MORE
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5. Towards Unconventional Applications of Wire Bonding
Abstract : This thesis presents novel heterogeneous integration approaches of wire materials to fabricated and package MEMS devices by exploring unconventional applications of wire bonding technology. Wire bonding, traditionally endemic in the realm of device packaging to establish electrical die-to-package interconnections, is an attractive back-end technology, offering promising features, such as high throughput, flexibility and placement accuracy. READ MORE