Search for dissertations about: "Microelectromechanical systems MEMS"

Showing result 1 - 5 of 22 swedish dissertations containing the words Microelectromechanical systems MEMS.

  2. 1. Novel RF MEMS Devices Enabled by Three-Dimensional Micromachining

    Author : Umer Shah; Joachim Oberhammer; Raafat Mansour; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Microelectromechanical systems; MEMS; Radio frequency microelectromechanical systems; RF MEMS; Micromachined transmission line; Micromachining; Tuneable capacitor; Switched capacitor; Coupled-line coupler; Tuneable directional coupler; Intermodulation distortion; MEMS varactor; Two-tone IIP3 measurement; Passive components and circuits; Reliability; Magnetic materials; NiFe multilayer composite; Permeability; Permittivity; Micromachined inductors;

    Abstract : This thesis presents novel radio frequency microelectromechanical (RF MEMS) circuits based on the three-dimensional (3-D) micromachined coplanar transmission lines whose geometry is re-configured by integrated microelectromechanical actuators. Two types of novel RF MEMS devices are proposed. READ MORE

  4. 2. Wafer-level heterogeneous integration of MEMS actuators

    Author : Stefan Braun; Göran Stemme; Martin A. Schmidt; KTH; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; Microelectromechanical systems; MEMS; silicon; wafer-level; integration; heterogeneous integration; transfer integration; packaging; assembly; wafer bonding; adhesive bonding; eutectic bonding; release etching; electrochemical etching; microvalves; microactuator; Shape Memory Alloy; SMA; NITINOL; TiNi; NiTi; cold-state reset; bias spring; stress layers; crossbar switch; routing; switch; switch array; electrostatic actuator; S-shaped actuator; zipper actuator; addressing; transfer stamping; blue tape; Computer engineering; Datorteknik;

    Abstract : This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. READ MORE

  5. 3. Integration and Fabrication Techniques for 3D Micro- and Nanodevices

    Author : Andreas C. Fischer; Frank Niklaus; Karl F. Böhringer; KTH; []
    Keywords : Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; chip-level; through silicon via; TSV; packaging; 3D packaging; vacuum packaging; liquid encapsulation; integration; heterogeneous integration; wafer bonding; microactuators; shape memory alloy; SMA; wire bonding; magnetic assembly; self-assembly; 3D; 3D printing; focused ion beam; FIB;

    Abstract : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. READ MORE

  6. 4. Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor

    Author : Mikael Antelius; Göran Stemme; Yogesh B. Gianchandani; KTH; []
    Keywords : Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; packaging; vacuum packaging; liquid encapsulation; integration; wire bonding; grating coupler; waveguide; Fabry-Perot resonator;

    Abstract : This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. READ MORE

  7. 5. Fluidic Microsystems for Micropropulsion Applications in Space

    Author : Johan Bejhed; Johan Köhler; Anders Eriksson; Greger Thornell; Thomas Laurell; Uppsala universitet; []
    Keywords : Engineering physics; microelectromechanical systems; MEMS; MST; microsystem; microfluidics; silicon; spacecraft; propulsion; space technology; Teknisk fysik;

    Abstract : Spacecraft on interplanetary missions or advanced satellites orbiting the Earth all require propulsion systems to complete their missions. Introducing microelectromechanical systems technology to the space industry will not only reduce size and weight of the propulsion system, but can also increase the performance of the mission. READ MORE