Search for dissertations about: "Microelectronics"

Showing result 1 - 5 of 65 swedish dissertations containing the word Microelectronics.

2. 1. Environmental Life-cycle Assessment in Microelectronics Packaging

   Author : Anders Andrae; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; System-In-a-Package; microelectronics packaging; data collection; attributional environmental life-cycle assessment; uncertainty analysis; upstream processes; consequential life-cycle assessment; environmental life-cycle inventory; microelectronic products;

   Abstract : An increased understanding of the application of environmental Life-Cycle Assessment (LCA) methodologies in the microelectronics packaging area should help in developing environmentally sound product systems. The aim of the present thesis is to increase the knowledge of using LCA tools, methods and models, in application to current and new microelectronic products. READ MORE

4. 2. Multiband LNA Design and RF-Sampling Front-Ends for Flexible Wireless Receivers

   Author : Stefan Andersson; Christer Svensson; Marc Tiebout; Linköpings universitet; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; RF; Microelectronics; Multiband LNAs; RF-Sampling; Sampling Front-Ends; Flexible Wireless Receivers; Multistandard Receivers.; Electronics; Elektronik;

   Abstract : The wireless market is developing very fast today with a steadily increasing number of users all around the world. An increasing number of users and the constant need for higher and higher data rates have led to an increasing number of emerging wireless communication standards. READ MORE

5. 3. Wafer Bonding - Problems and Possibilities

   Author : Mats Bergh; Chalmers tekniska högskola; []
   Keywords : NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; SOI; atomic force microscope; micromechanics; compliant substrates; wafer bonding; semi-insulating silicon; AFM; surface chemistry; diamond; silicon on insulator; aluminium nitride; microelectronics; surface roughness;

   Abstract : The wafer bonding technology offers a unique opportunity to combine different materials. This has been used for the realisation of novel silicon on insulator (SOI) structures. By replacing the buried silicon dioxide layer with a polycrystalline diamond film the thermal properties of the SOI structure are improved. READ MORE

6. 4. Efficient high-speed on-chip global interconnects

   Author : Peter Caputa; Christer Svensson; Hartmut Grabinski; Linköpings universitet; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Microelectronics; Global Interconnects; On-Chip Interconnects; Velocity-of-Light Delay; On-Chip Communication; Low-Latency; Transmission Lines; Electronics; Elektronik;

   Abstract : The continuous miniaturization of integrated circuits has opened the path towards System-on-Chip realizations. Process shrinking into the nanometer regime improves transistor performancewhile the delay of global interconnects, connecting circuit blocks separated by a long distance, significantly increases. READ MORE

7. 5. Development of Nanoimprint Lithography for Applications in Electronics, Photonics and Life-sciences

   Author : Patrick Carlberg; Fasta tillståndets fysik; []
   Keywords : NATURVETENSKAP; NATURAL SCIENCES; Mikroelektronik; Microelectronics; Teknik; ballistic; Technological sciences; Fysik; Physics; nanowire; TBJ; cantilever; IDA electrode; sensors; life-science; lift-off; patterning media; anti-sticking; mold; stamp; process development; thermal imprint; nanoimprint lithography; Biotechnology; Bioteknik; nanotechnology; polymer; nanostructure;

   Abstract : This thesis describes different aspects of nanotechnology manufacturing with nanoimprint lithography (NIL), a relatively new nanofabrication tool capable of high resolution and high throughput. Surface structure creation with NIL is based on mechanical deformation of the patterning material. READ MORE