Search for dissertations about: "Microsystem Technology"

Showing result 1 - 5 of 36 swedish dissertations containing the words Microsystem Technology.

  1. 1. From Macro to Nano : Electrokinetic Transport and Surface Control

    Author : Gaspard Pardon; Wouter van der Wijngaart; Philippe Renaud; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; microsystem; nanosystem; microfluidic; nanofluidic; surface modification; surface property; electrokinetics; model; simulation; material; polymer; thiol-ene; microfabrication; nanofabrication; micromanufacturing; nanomanufacturing; breath sampling; aerosol precipitation; corona discharge; electrostatic precipitation; grafting chemistry; click chemistry; nanopore; nanoporous membrane; photolithography; photopatterning; photografting; microfluidics; nanofluidics; oste; OSTE ; OSTEmer; lab-on-chip; loc; point-of-care; poc; biocompatibility; diagnostics; breath analysis; fuel cell; Electrical Engineering; Elektro- och systemteknik; Teknisk materialvetenskap; Materials Science and Engineering; Fysik; Physics; Medical Technology; Medicinsk teknologi;

    Abstract : Today, the growing and aging population, and the rise of new global threats on human health puts an increasing demand on the healthcare system and calls for preventive actions. To make existing medical treatments more efficient and widely accessible and to prevent the emergence of new threats such as drug-resistant bacteria, improved diagnostic technologies are needed. READ MORE

  2. 2. Integrated Communications and Thermal Management Systems for Microsystem-based Spacecraft : A Multifunctional Microsystem Approach

    Author : Henrik Kratz; Anders Rydberg; Johan Köhler; Pelle Rangsten; Uppsala universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electronics; nanospacecraft; MST; MEMS; silicon; communication; thermal management; antenna; paraffin; PCM; multifunctional; microsystems; Elektronik; Electronics; Elektronik;

    Abstract : This thesis explores the potential of multifunctional silicon-based microsystems for advanced integrated nanospacecraft (AIN). Especially, multifunctional microsystems with the coexistant functions of communications and thermal management implemented in multilayer silicon stacks are approached with systems study. READ MORE

  3. 3. A Fully Integrated Microneedle-based Transdermal Drug Delivery System

    Author : Niclas Roxhed; Göran Stemme; Mark G. Allen; KTH; []
    Keywords : MEDICIN OCH HÄLSOVETENSKAP; MEDICAL AND HEALTH SCIENCES; Microneedle; Transdermal; Intradermal; Drug delivery; DRIE; MEMS; Microsystem; Medical technology; Medicinsk teknik;

    Abstract : Patch-based transdermal drug delivery offers a convenient way to administer drugs without the drawbacks of standard hypodermic injections relating to issues such as patient acceptability and injection safety. However, conventional transdermal drug delivery is limited to therapeutics where the drug can diffuse across the skin barrier. READ MORE

  4. 4. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

    Author : Shuangxi Sun; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TIM; G-CNT; electrical resistivity; VA-CNTs; thermal resistance; 3D IC integration; TSV; graphene; VA-CNT-Solder; VA-CNT-Cu;

    Abstract : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. READ MORE

  5. 5. Modelling and Reliability Assessment of Microsystem Interconnections

    Author : Yan Zhang; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; cohesive zone model; discontinuous regularization; Micropolar theory; homogenization; microsystem interconnection;

    Abstract : With the continuous increase of packaging density, the electronic component size and, in particular, the thickness of the involved interconnections decrease significantly. In addition, the microsystem interconnects usually include even finer internal structures. READ MORE