Search for dissertations about: "Multi-Chip Module"

Showing result 1 - 5 of 7 swedish dissertations containing the words Multi-Chip Module.

  1. 1. Flip-Chip Interconnect for Millimeter-Wave Packaging Applications

    Author : Li-Han Hsu; Chalmers University of Technology; []
    Keywords : Underfill; Packaging; V-band; Fabrication; Millimeter-Waves; MMICs; 60 GHz; Multi-Chip Module; Interconnect; Organic laminate; Reliability.; Flip-Chip; Design;

    Abstract : In recent years, with the demands for wireless communication systems increas rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC components but also competent package with low cost and good interconnect performance. READ MORE

  2. 2. Superconducting High Speed Passive Interconnects

    Author : Raihan Rafique; Chalmers University of Technology; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Rapid Single Flux Quantum RSFQ ; Superconducting Microstrip Line SMSL ; RSFQ Driver.; Interconnect Discontinuities; Multi-Chip-Module MCM ;

    Abstract : Superconducting digital RSFQ technology offers unique digital processing solutions for the telecommunication that allows more than three times increasing capacity of the 3G networks, makes telecommunication receivers reconfigurable and adjustable for different services, and significantly enhances security level of the data transfer over the fibers.Key features of RSFQ technology are high speed, low power and high integration density. READ MORE

  3. 3. Experimental Verification of Superconductor Digital Circuits

    Author : Henrik Engseth; Chalmers University of Technology; []
    Keywords : Cryocooler.; Superconductivity; Multi Chip Modules MCM ; high frequency test; Rapid Single Flux Quantum RSFQ logic; heatload;

    Abstract : AbstractSuperconducting digital technology based on Rapid Single Flux Quantum (RSFQ) logic offers a 50 times faster clock rate and 100 times less on chip power consumption than today's mainstream semiconductor electronics. This technology is attractive for many applications and in particular for Digital Signal Processing (DSP). READ MORE

  4. 4. Fabrication of Electroacoustic Devices for Integrated Applications

    Author : Johannes Enlund; Ilia Katardjiev; Jörgen Olsson; Uppsala universitet; []
    Keywords : ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; Engineering physics; Teknisk fysik; Elektronik; Electronics;

    Abstract : Electroacoustic technology has in many ways revolutionised the wireless telecommunication industry. The IC compatible fabrication technique of thin film electroacoustic devices has so far provided a considerable increase in device performance and reduction in size. At the moment, new areas where this technology can be of use is under investigation. READ MORE

  5. 5. Miniaturized Multifunctional System Architecture for Satellites and Robotics

    Author : Fredrik Bruhn; Jan-Åke Schweitz; Lars Stenmark; Johan Köhler; Thomas George; Uppsala universitet; []
    Keywords : ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Space technology; Multifunctional design; Spacecraft; Robotics; Microengineering; MEMS; Exploration; Distributed intelligence; Mission Design; Rymdteknik; Space engineering; Rymdteknik;

    Abstract : This thesis describes and evaluates the design of nanospacecraft based on advanced multifunctional microsystems building blocks. These systems bring substantial improvements of the performance of nanosatellites and enable new space exploration, e.g. interplanetary science missions using minute space probes. READ MORE