Search for dissertations about: "NANO engineering THESIS"

Showing result 1 - 5 of 683 swedish dissertations containing the words NANO engineering THESIS.

  1. 1. From Macro to Nano : Electrokinetic Transport and Surface Control

    Author : Gaspard Pardon; Wouter van der Wijngaart; Philippe Renaud; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; microsystem; nanosystem; microfluidic; nanofluidic; surface modification; surface property; electrokinetics; model; simulation; material; polymer; thiol-ene; microfabrication; nanofabrication; micromanufacturing; nanomanufacturing; breath sampling; aerosol precipitation; corona discharge; electrostatic precipitation; grafting chemistry; click chemistry; nanopore; nanoporous membrane; photolithography; photopatterning; photografting; microfluidics; nanofluidics; oste; OSTE ; OSTEmer; lab-on-chip; loc; point-of-care; poc; biocompatibility; diagnostics; breath analysis; fuel cell; Electrical Engineering; Elektro- och systemteknik; Teknisk materialvetenskap; Materials Science and Engineering; Fysik; Physics; Medical Technology; Medicinsk teknologi;

    Abstract : Today, the growing and aging population, and the rise of new global threats on human health puts an increasing demand on the healthcare system and calls for preventive actions. To make existing medical treatments more efficient and widely accessible and to prevent the emergence of new threats such as drug-resistant bacteria, improved diagnostic technologies are needed. READ MORE

  2. 2. Characterization of nano-scale materials for interconnect and thermal dissipation application in electronics packaging

    Author : Xin Luo; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; thermal conductivity; thermal interface material; thermal management; boron nitride fiber; electrospun nanofiber; lead-free solder; carbon fiber; nano-scale oxide layer; metal matrix composite;

    Abstract : This thesis focuses on studies of nano-scale materials in electronic packaging applications with respect to following aspects: surface analysis of nano-scale oxide of lead-free solder particles, and thermal performance and mechanical property studies of nano-scale fiber and metal composite-based thermal interface materials. The composition and thickness of the solder oxide have a direct impact on the quality of interconnects and the reliability of a packaged system. READ MORE

  3. 3. Mid-infrared photonic devices for on-chip optical gas sensing

    Author : Floria Ottonello Briano; Kristinn B. Gylfason; Delphine Marris-Morini; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; NATURVETENSKAP; NATURAL SCIENCES; mid-infrared; mid-IR; photonics; silicon photonics; gas sensing; optical sensing; optical gas sensing; spectroscopy; absorption; dispersion; carbon dioxide; CO2; CO2 sensing; trace gas; ethanol sensing; alcohol sensing; waveguide; photonic waveguide; ring resonator; nanowire; nanoheater; emitter; thermal source; bolometer; microbolometer; thermal detector; high frequency; 3 omega method; plasmonic; platinum; Kanthal; silicon-on-insulator; micro-electro-mechanical systems MEMS ; microfabrication; microsystems; microtechnology; nanotechnology; Optik och fotonik; Optics and Photonics; Electrical Engineering; Elektro- och systemteknik;

    Abstract : Gas detection is crucial in a wide range of fields and applications, such as safety and process control in the industry, atmospheric sciences, and breath diagnostics. Optical gas sensing offers some key advantages, compared to other sensing methods such as electrochemical and semiconductor sensing: high specificity, fast response, and minimal drift. READ MORE

  4. 4. Wideband THz Mixers and Components for the Next Generation of Receivers for Radioastronomy

    Author : Cristian Daniel López; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Spectroscopy; Heterodyne receivers; Finline; Superconductor-Insulator-Superconductor SIS mixers.; Waveguide-to-Substrate Transition; Waveguide twist;

    Abstract : In recent decades, there has been a growing interest in THz research, leading to substantial improvements in technology and the emergence of new applications. In particular, the ever-evolving field of radio astronomy instrumentation has been pushing the limits of millimeter and sub-millimeter technology boundaries, redefining the state-of-the-art for wideband low-noise receivers. READ MORE

  5. 5. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

    Author : Shuangxi Sun; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TIM; G-CNT; electrical resistivity; VA-CNTs; thermal resistance; 3D IC integration; TSV; graphene; VA-CNT-Solder; VA-CNT-Cu;

    Abstract : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. READ MORE