Search for dissertations about: "ORMOCER"

Found 4 swedish dissertations containing the word ORMOCER.

  2. 1. ORMOCER Materials Characterization, LAP- & Micro-Processing : Applied to Optical Interconnects and High-Frequency Packaging

    Author : Steffen Uhlig; Mats Robertsson; Peter van Daele; Linköpings universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Optical interconnects; Optical Backplanes; ORMOCER; SBU-technology; high-frequency packaging; surface characterization; Electrical engineering; electronics and photonics; Elektroteknik; elektronik och fotonik;

    Abstract : ORMOCERR®s are organic-inorganic hybrid polymers. Since their material properties can be tailored precisely during synthesis, they are suitable for a wide range of applications in dielectric and optical microelectronics. READ MORE

  4. 2. High frequency electronic packaging : SBU-materials, material characterization, simulation and processing

    Author : Christian Johansson; Hjalmar Hesselbom; Linköpings universitet; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; dielectric loss; high frequency electrical characterization; microwave circuits; multilayer thin film technology; ORMOCER; permittivity; sequential build up; silicone elastomer;

    Abstract : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both High Density Interconnects (HDI) and high frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. READ MORE

  5. 3. High frequency electronic packaging and components : characterization, simulation, materials and processing

    Author : Christian Johansson; Mats Robertsson; Li-Rong Zheng; Linköpings universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Dielectric loss; high frequency electrical characterization; microwave circuits; multilayer thin film technology; ORMOCER®; permittivity; printed diode; sequential build-up; silicone elastomer; Signal processing; Signalbehandling;

    Abstract : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both high density interconnects and high frequency devices have led to the search for new materials, material combinations, methods, processes and production equipment. READ MORE

  6. 4. Optical interconnects and high frequency electronic packaging : SBU-materials, material characterization, LAP- & microprocessing

    Author : Steffen Uhlig; Linköpings universitet; []
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; optical interconnects; overview opto coupling components; overview planar waveguide amplifiers; large area panel processing; polymer waveguides; multilayer thin film technology; ORMOCER®; sequential build up; permittivity; dielectric loss;

    Abstract : The main objective of this thesis is to discuss and demonstrate optical interconnect technologies. These can be used to enhance the data throughput capacity of future printed circuit boards and backplanes, i.e. exchange Copper conductors with light conductors. READ MORE