Search for dissertations about: "Packaging Engineering"

Showing result 1 - 5 of 259 swedish dissertations containing the words Packaging Engineering.

  2. 1. Soft Intelligence : Liquids Matter in Compliant Microsystems

    Author : Seung Hee Jeong; Zhigang Wu; Zhi-Bin Zhang; Michael D. Dickey; Uppsala universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Liquid; Elastomer; Cross-linking; Liquid alloy; PDMS; Adaptability; Compliance; Interface; Patterning; Printing; Surface energy; Wetting; Composite; Modulus; Stretchability; Viscoelasticity; Thermal conductivity; Contact resistance; Adhesion; Packaging; Integration; Microsystems; Microfluidics; Strain sensor; Thermoelectrics; Inductive coupling; Wireless communication; Stretchable electron-ics; Epidermal electronics; Skin electronics; Soft robotics; Wearable electronics; Teknisk fysik med inriktning mot mikrosystemteknik; Engineering Science with specialization in Microsystems Technology; Engineering Science with specialization in Materials Science; Teknisk fysik med inriktning mot materialvetenskap;

    Abstract : Soft matter, here, liquids and polymers, have adaptability to a surrounding geometry. They intrinsically have advantageous characteristics from a mechanical perspective, such as flowing and wetting on surrounding surfaces, giving compliant, conformal and deformable behavior. READ MORE

  4. 2. Packaging Networks : a framework for integrating packaging suppliers in the demand chain

    Author : Chris Dominic; Gunilla Jönson; Lennart Hjält; Förpackningslogistik; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; packaging logistics; demand chain management; logistics; network integrator; packaging integrator; packaging logistics; demand chain management; logistics; network integrator; packaging integrator;

    Abstract : The ability to understand packaging and how it contributes to the establishment of efficient logistics and the creation of individualised values for consumers is becoming increasingly important. This licentiate thesis stresses the importance of applying a holistic view of packaging in order to be able to understand how to adapt the distribution channel to meet consumer demands. READ MORE

  5. 3. Characterization of nano-scale materials for interconnect and thermal dissipation application in electronics packaging

    Author : Xin Luo; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; thermal conductivity; thermal interface material; thermal management; boron nitride fiber; electrospun nanofiber; lead-free solder; carbon fiber; nano-scale oxide layer; metal matrix composite;

    Abstract : This thesis focuses on studies of nano-scale materials in electronic packaging applications with respect to following aspects: surface analysis of nano-scale oxide of lead-free solder particles, and thermal performance and mechanical property studies of nano-scale fiber and metal composite-based thermal interface materials. The composition and thickness of the solder oxide have a direct impact on the quality of interconnects and the reliability of a packaged system. READ MORE

  6. 4. Affective Surface Engineering for Product Design

    Author : Martin Bergman; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; SAMHÄLLSVETENSKAP; SOCIAL SCIENCES; semantics; Design research; total appearance; soft metrology; surface roughness; technical functions; core values; product interaction; kansei engineering; emotional functions; hard metrology; sensation and perception;

    Abstract : Design research, sensation and perception, hard metrology, emotional functions, semantics, surface roughness, product interaction, core values, total appearance… the list of scientific phrases never ends. Yet, what do they mean and how shall we use it when we are communicating with the industry and our end users? Is it possible to link the product experience to process parameters, put a number onto it? When you can measure spoken needs or even better, implied needs, of a product, and relate that data to the production, it is possible do create advanced products with high interaction stimuli. READ MORE

  7. 5. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

    Author : Shuangxi Sun; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TIM; G-CNT; electrical resistivity; VA-CNTs; thermal resistance; 3D IC integration; TSV; graphene; VA-CNT-Solder; VA-CNT-Cu;

    Abstract : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. READ MORE