Search for dissertations about: "Packaging of Microwave Components"
Showing result 1 - 5 of 10 swedish dissertations containing the words Packaging of Microwave Components.
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1. High frequency electronic packaging and components : characterization, simulation, materials and processing
Abstract : Electronic packaging continues to move towards improved performance and lower cost. Requirements of higher performance, reduced size, weight and cost of both high density interconnects and high frequency devices have led to the search for new materials, material combinations, methods, processes and production equipment. READ MORE
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2. Novel RF MEMS Switch and Packaging Concepts
Abstract : Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to switch, modulate, filter or tune electrical signals from DC to microwave frequencies. The micromachining techniques used to fabricate these components are based on the standard clean-room manufacturing processes for high-volume integrated semiconductor circuits. READ MORE
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3. Gap waveguide for packaging microstrip filters & investigation of transitions from planar technologies to ridge gap waveguide
Abstract : Gap waveguide technology has proved to constitute an effective alternative for the design of microwave passive components, due to its advantages with respect to traditional planar technologies and standard waveguides. There is no requirement for conductive contact between the two different metal pieces making up a gap waveguide prototype, since one of these pieces makes use of a textured surface that eliminates any possible leakage of the field through the gap to the surface of the other metal piece above it. READ MORE
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4. Gap Waveguide for High Frequency Microwave Application- Validation of Concept, Filter Design & Packaging Aspects
Abstract : The overall goal of this thesis is to validate the low loss performance of recently evolved gap waveguide technology and to use this low loss technology for designing critical passive microwave component such as narrow band filter. Also, the exploitation of gap waveguide concept as a packaging solution for densely packed RF circuitry has been presented in this thesis. READ MORE
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5. Gap Waveguide: Low Loss Microwave Passive Components and MMIC Packaging Technique for High Frequency Applications
Abstract : The heavy congestion at the existing radio frequency spectrum allocated for the today’s wireless communications motivates and accelerates the research work at mmWave bands or even higher frequency range where more spectrum space is available for massive data rate delivery. The inclination of modern wireless system research and development is towards small size, reliable, high-performance and high-yield microwave multifunctional products. READ MORE