Search for dissertations about: "SPICE Gummel-poon"

Found 2 swedish dissertations containing the words SPICE Gummel-poon.

  2. 1. SiC Readout IC for High Temperature Seismic Sensor System

    Author : Ye Tian; Carl-Mikael Zetterling; Ana Rusu; Philip A. Mawby; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Silicon carbide SiC ; bipolar junction transistor BJT ; integrated circuit IC ; sigma-delta Σ∆ ; data conversion; operational amplifier OpAmp ; VBIC; SPICE Gummel-poon; high-temperature; electromechanical; accelerometer; capacitive sensor; Informations- och kommunikationsteknik; Information and Communication Technology;

    Abstract : Over the last decade, electronics operating at high temperatures have been increasingly demanded to support in situ sensing applications such as automotive, deep-well drilling and aerospace. However, few of these applications have requirements above 460 °C, as the surface temperature of Venus, which is a specific target for the seismic sensing application in this thesis. READ MORE

  4. 2. High-Temperature Analog and Mixed-Signal Integrated Circuits in Bipolar Silicon Carbide Technology

    Author : Raheleh Hedayati; Carl-Mikael Zetterling; H. Alan Mantooth; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; silicon carbide SiC ; bipolar junction transistor BJT ; high temperature; SiC integrated circuit; Spice Gummel-Poon SGP ; operational amplifier opamp ; negative feedback amplifier; bandgap reference; masterslave comparator; digital-to-analog converter DAC ; analog-to-digital converter ADC ; flash ADC; successive approximation register SAR ADC; Electrical Engineering; Elektro- och systemteknik;

    Abstract : Silicon carbide (SiC) integrated circuits (ICs) can enable the emergence of robust and reliable systems, including data acquisition and on-site control for extreme environments with high temperature and high radiation such as deep earth drilling, space and aviation, electric and hybrid vehicles, and combustion engines. In particular, SiC ICs provide significant benefit by reducing power dissipation and leakage current at temperatures above 300 °C compared to the Si counterpart. READ MORE