Search for dissertations about: "Si"

Showing result 1 - 5 of 705 swedish dissertations containing the word Si.

  1. 1. Structured LDPC convolutional codes

    University dissertation from Stockholm : KTH Royal Institute of Technology

    Author : Zhongwei Si; KTH.; KTH.; [2012]
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; SRA - ICT; SRA - Informations- och kommunikationsteknik;

    Abstract : LDPC convolutional codes, also known as spatially coupled LDPC codes, have attracted considerable attention due to their promising properties. By coupling the protographs from different positions into a chain and terminating the chain properly, the resulting convolutional-like LDPC code ensemble is able to produce capacity-achieving performance in the limit of large parameters. READ MORE

  2. 2. Application of Metallic Nanoparticles and Vertically Aligned Carbon Nanotubes as Interconnect Materials for Electronics Packaging

    University dissertation from Stockholm : KTH Royal Institute of Technology

    Author : Si Chen; [2013]
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Carbon nanofibers; Fracture surface; Electronics packaging; Thermal fatigue; Electrical resistance; Shear strength; Interconnect materials; Nanocomposite solder;

    Abstract : In the electronics industry, packaging is responsible to protect chip from atmosphere and provide the path for signal communication as well as thermal dissipation. The realization of these functions in a packaging system depends on the performance of interconnect materials. Any failure on the interconnect materials could make entire system down. READ MORE

  3. 3. Characterization of Nanomaterials for Interconnect and Thermal Management in Electronic Packaging

    University dissertation from Stockholm : KTH Royal Institute of Technology

    Author : Si Chen; [2015]
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; heat dissipation; electronic packaging; nanomaterial; characterization; thermal interface material; solder; thermoelectric.; interconnect; through silicon via;

    Abstract : Electronic packaging, protecting the fragile chip from atmosphere and providing the paths for signal transmission as well as heat dissipation, is one of the most important parts in electronic devices. The cost, dimensions, performance, and reliability of an electronic device therefore strongly depend on its packaging structures and materials. READ MORE

  4. 4. Electronic Sensors Based on Nanostructured Field-Effect Devices

    University dissertation from Uppsala : Acta Universitatis Upsaliensis

    Author : Si Chen; Uppsala universitet.; [2013]
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; biosensor; field-effect transistor; nanowire; ISFET; Elektronik; Electronics;

    Abstract : Point-of-care (POC) diagnostics presents a giant market opportunity with profound societal impact. In particular, specific detection of DNA and protein markers can be essential for early diagnosis of e.g. cancer, cardiovascular disease, infections or allergies. READ MORE

  5. 5. Miniaturized localized surface plasmon resonance biosensors

    University dissertation from Uppsala : Acta Universitatis Upsaliensis

    Author : Si Chen; [2013]
    Keywords : NATURVETENSKAP; NATURAL SCIENCES; NATURVETENSKAP; NATURAL SCIENCES; NATURVETENSKAP; NATURAL SCIENCES; NATURVETENSKAP; NATURAL SCIENCES; NATURVETENSKAP; NATURAL SCIENCES; colloidal lithography; Surface plasmon resonance; biosensing; electron beam lithography; single molecule; hyperspectral imaging; photo functionalization;

    Abstract : Abstract Reliable and sensitive biosensors are required for fast and accurate diagnostics. Localized surface plasmon resonances (LSPRs) in noble-metal nanoparticles possess very high refractive index sensitivity close to the metal surface and therefore constitute an attractive biosensing platform. READ MORE