Search for dissertations about: "Solder"

Showing result 1 - 5 of 23 swedish dissertations containing the word Solder.

  1. 1. Solder Matrix Fiber Composite Thermal Interface Materials

    Author : Josef Hansson; Chalmers University of Technology; []
    Keywords : NATURVETENSKAP; TEKNIK OCH TEKNOLOGIER; TEKNIK OCH TEKNOLOGIER; NATURAL SCIENCES; ENGINEERING AND TECHNOLOGY; ENGINEERING AND TECHNOLOGY; thermal management; composite materials; solder; thermal interface material;

    Abstract : Overheating has been a problem for microelectronics devices for decades, and the problem is exacerbated by the continued trend of miniaturization of features and the corresponding increase in power density. Thermal interface materials (TIMs) target one of the main bottlenecks in heat transfer: the interface between two materials, such as between a heat-generating microchip and a heatsink. READ MORE

  2. 2. Exploration of Metal Composites and Carbon Nanotubes for Thermal Interfaces

    Author : Josef Hansson; Chalmers University of Technology; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Carbon nanotubes; Solder; Thermal interface materials;

    Abstract : Modern microelectronics are perpetually pushing against limitations caused by inadequate heat dissipation. One of the critical bottlenecks is at the interfaces between different materials and components. READ MORE

  3. 3. Characterization of Nanomaterials for Interconnect and Thermal Management in Electronic Packaging

    Author : Si Chen; Chalmers University of Technology; []
    Keywords : heat dissipation; electronic packaging; nanomaterial; characterization; thermal interface material; solder; thermoelectric.; interconnect; through silicon via;

    Abstract : Electronic packaging, protecting the fragile chip from atmosphere and providing the paths for signal transmission as well as heat dissipation, is one of the most important parts in electronic devices. The cost, dimensions, performance, and reliability of an electronic device therefore strongly depend on its packaging structures and materials. READ MORE

  4. 4. Low Cycle Fatigue Reliability and Interfacial Reaction of Lead-free Solder Joints for Electronic Packaging

    Author : Sun Peng; Chalmers University of Technology; []
    Keywords : Finite Element Simulation; Reliability; Intermetallic Compounds; Lead-free Solder; Low Cycle Fatigue;

    Abstract : Two key technologies in electronics industry are chip technology and packaging technology. Solder plays a crucial role in the assembly and interconnection in the electronic packaging industry. As a joint material, solder provides electronic, thermal and mechanical continuity. READ MORE

  5. 5. Application of Metallic Nanoparticles and Vertically Aligned Carbon Nanotubes as Interconnect Materials for Electronics Packaging

    Author : Si Chen; Chalmers University of Technology; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Carbon nanofibers; Fracture surface; Electronics packaging; Thermal fatigue; Electrical resistance; Shear strength; Interconnect materials; Nanocomposite solder;

    Abstract : In the electronics industry, packaging is responsible to protect chip from atmosphere and provide the path for signal communication as well as thermal dissipation. The realization of these functions in a packaging system depends on the performance of interconnect materials. Any failure on the interconnect materials could make entire system down. READ MORE