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Showing result 1 - 5 of 24 swedish dissertations matching the above criteria.
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1. Solder Matrix Fiber Composite Thermal Interface Materials
Abstract : Overheating has been a problem for microelectronics devices for decades, and the problem is exacerbated by the continued trend of miniaturization of features and the corresponding increase in power density. Thermal interface materials (TIMs) target one of the main bottlenecks in heat transfer: the interface between two materials, such as between a heat-generating microchip and a heatsink. READ MORE
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2. Exploration of Metal Composites and Carbon Nanotubes for Thermal Interfaces
Abstract : Modern microelectronics are perpetually pushing against limitations caused by inadequate heat dissipation. One of the critical bottlenecks is at the interfaces between different materials and components. READ MORE
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3. Characterization of Nanomaterials for Interconnect and Thermal Management in Electronic Packaging
Abstract : Electronic packaging, protecting the fragile chip from atmosphere and providing the paths for signal transmission as well as heat dissipation, is one of the most important parts in electronic devices. The cost, dimensions, performance, and reliability of an electronic device therefore strongly depend on its packaging structures and materials. READ MORE
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4. Low Cycle Fatigue Reliability and Interfacial Reaction of Lead-free Solder Joints for Electronic Packaging
Abstract : Two key technologies in electronics industry are chip technology and packaging technology. Solder plays a crucial role in the assembly and interconnection in the electronic packaging industry. As a joint material, solder provides electronic, thermal and mechanical continuity. READ MORE
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5. Application of Metallic Nanoparticles and Vertically Aligned Carbon Nanotubes as Interconnect Materials for Electronics Packaging
Abstract : In the electronics industry, packaging is responsible to protect chip from atmosphere and provide the path for signal communication as well as thermal dissipation. The realization of these functions in a packaging system depends on the performance of interconnect materials. Any failure on the interconnect materials could make entire system down. READ MORE