Search for dissertations about: "Solder"

Showing result 6 - 10 of 24 swedish dissertations containing the word Solder.

  1. 6. Thermal Fatigue Life Prediction of Solder Joints in Avionics by Surrogate Modeling : A Contribution to Physics of Failure in Reliability Prediction

    Author : Jonas Arwidson; Peter Leisner; Kouchi Zhang; Linköpings universitet; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY;

    Abstract : Manufacturers of aerospace, defense, and high performance (ADHP) equipment are currently facing multiple challenges related to the reliability of electronic systems. The continuing reduction in size of electronic components combined with increasing clock frequencies and greater functionality, results in increased power density. READ MORE

  2. 7. Characterization of nano-scale materials for interconnect and thermal dissipation application in electronics packaging

    Author : Xin Luo; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; thermal conductivity; thermal interface material; thermal management; boron nitride fiber; electrospun nanofiber; lead-free solder; carbon fiber; nano-scale oxide layer; metal matrix composite;

    Abstract : This thesis focuses on studies of nano-scale materials in electronic packaging applications with respect to following aspects: surface analysis of nano-scale oxide of lead-free solder particles, and thermal performance and mechanical property studies of nano-scale fiber and metal composite-based thermal interface materials. The composition and thickness of the solder oxide have a direct impact on the quality of interconnects and the reliability of a packaged system. READ MORE

  3. 8. Carbon Based Materials Synthesis and Characterization for 3D Integrated Electronics

    Author : Shuangxi Sun; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; NATURVETENSKAP; NATURAL SCIENCES; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TIM; G-CNT; electrical resistivity; VA-CNTs; thermal resistance; 3D IC integration; TSV; graphene; VA-CNT-Solder; VA-CNT-Cu;

    Abstract : 3D IC packaging technology extends Moore’s law and shifts the IC field into a new generation of smaller, but more powerful devices. Interconnection and thermal management as two critical parts of 3D IC integration packaging, are facing harsh challenges due to the miniaturization of IC devices. READ MORE

  4. 9. Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging

    Author : Peng Sun; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging; Low Cycle Fatigue; Intermetallic Compounds; Lead-Free Solders; Finite Element Simulation;

    Abstract : Two key technologies used by the electronics industry are chip technology and packaging technology. Solder plays a crucial role in both of them. During the last decade, there has been a strong worldwide environmental movement towards lead-free electronic products. READ MORE

  5. 10. Reliability, fatigue and mechanical characterization of lead-free solders for electronic packaging applications

    Author : Cristina Andersson; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Reliability.; Isothermal mechanical fatigue; Tensile tests; Mechanical behavior; Electronics; Thermal fatigue; Lead-free solders; Low cycle fatigue;

    Abstract : The ever increasing amount of electronic waste, most of which ends up in landfills, has become a serious worldwide concern. In addition to this, the fact that Pb is highly toxic and harmful to humans has lead to the ban of this element from the electronics industry. READ MORE