Search for dissertations about: "Teknisk materialvetenskap - Övrig teknisk materialvetenskap"
Showing result 11 - 15 of 35 swedish dissertations containing the words Teknisk materialvetenskap - Övrig teknisk materialvetenskap.
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11. Metal release from powder particles in synthetic biological media
Abstract : Humans are exposed to metals and metal-containing materials daily, either conscious, e.g. using metal tools or objects, or unconscious, e.g. READ MORE
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12. Numerical simulation of shape rolling
Abstract : In the first part of this thesis, the FE program MSC.Marc is applied for coupled thermomechanical simulations of wire-rod rolling. In order to predict material behaviour of an AISI 302 stainless steel at high strain rates generated during wire-rod rolling, a material model based on dislocation density is applied. READ MORE
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13. Corrosion-induced release of zinc and copper in marine environments
Abstract : This licentiate study was initiated by copper, zinc and galvanized steel producers in Europe, who felt a need to assess runoff rates of copper and zinc from the pure metals and commercial products at marine exposure conditions. Their motive was the increasing concern in various European countries and the on-going risk assessments of copper and zinc within the European commission. READ MORE
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14. Electronic structure and optical properties of PbY and SnY (Y=S, Se, and Te)
Abstract : Lead chalcogenides and tin chalcogenides and their alloys are IV−VI family semiconductors with unique material properties compared with similar semiconductors. For instance, PbY (Y = S, Se, and Te) are narrow-gap semiconductors with anomalous negative pressure coefficient and positive temperature coefficient. READ MORE
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15. Simulation of diffusional processes in alloys : techniques and applications
Abstract : This thesis concerns computer simulation of diffusional processes in alloys. The main focus is on the development of simulation techniques for diffusion in single-phase domains, but also diffusion controlled phase-transformations and interfacial processes are discussed. READ MORE