Search for dissertations about: "Three-dimensional 3-D Integration"
Found 1 swedish dissertation containing the words Three-dimensional 3-D Integration.
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1. System Interconnection Design Trade-offs in Three-Dimensional (3-D) Integrated Circuits
Abstract : Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. Significant research effort spanning many decades has been expended on traditional VLSI integration technologies, encompassing process, circuit and architectural issues to tackle these problems. READ MORE