Search for dissertations about: "Wafer-Level-Packaging"

Found 4 swedish dissertations containing the word Wafer-Level-Packaging.

  2. 1. Microwave CMOS LNAs and VCOs - Using Passives On-Chip, Above Chip, and Off-Chip

    Author : Lars Aspemyr; Institutionen för elektro- och informationsteknik; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; VCO; LNA; CMOS; Wafer-Level-Packaging; Ferro-electric varactor; System-on-Package;

    Abstract : The performance of LNAs and VCOs is of large importance to the complete wireless communications system. To achieve sufficient performance in microwave applications, LNAs and VCOs have therefore up to now mostly been manufactured in advanced and expensive semiconductor technologies. READ MORE

  4. 2. Wafer-level 3-D CMOS Integration of Very-large-scale Silicon Micromirror Arrays and Room-temperature Wafer-level Packaging

    Author : Martin Lapisa; Frank Niklaus; Olav Solgaard; KTH; []
    Keywords : ;

    Abstract : This thesis describes the development of wafer-level fabrication and packaging methods for micro-electromechanical (MEMS) devices, based on wafer-bonding.The first part of the thesis is addressing the development of a wafer-level technology that allows the use of high performance materials, such as monocrystalline silicon, for MEMS devices that are closely integrated on top of sensitive integrated circuits substrates. READ MORE

  5. 3. Novel RF MEMS Switch and Packaging Concepts

    Author : Joachim Oberhammer; KTH; []
    Keywords : 0-level packaging; adhesive bonding; BCB; benzocyclobutene; bond strength; contact printing; film actuator; glass lid encapsulation; glass lid packaging; helium leak test; hermetic packaging; hermeticity; high isolation switch; low stress silicon nitride; low volt; TECHNOLOGY; TEKNIKVETENSKAP;

    Abstract : Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to switch, modulate, filter or tune electrical signals from DC to microwave frequencies. The micromachining techniques used to fabricate these components are based on the standard clean-room manufacturing processes for high-volume integrated semiconductor circuits. READ MORE

  6. 4. Integration and Packaging Concepts for Infrared Bolometer Arrays

    Author : Adit Decharat; Göran Stemme; Sjoerd Haasl; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Fabrication; Bonding; packaging; microbolometer; Thermal imaging.; Other electrical engineering; electronics and photonics; Övrig elektroteknik; elektronik och fotonik;

    Abstract :   Infrared (IR) imaging devices based on energy detection has shown a dramatic development in technology along with an impressive price reduction in recent years. However, for a low-end market as in automotive applications, the present cost of IR cameras is still the main obstacle to broadening their usage. READ MORE