Search for dissertations about: "adhesive systems"

Showing result 1 - 5 of 52 swedish dissertations containing the words adhesive systems.

  1. 1. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

    Author : Niklaus Frank; KTH; []
    Keywords : adhesive; wafer; bonding; low temperature; CMOS compatible; selective; local; polymer; thermoplastic; thermosetting; intermediate layer; coating; benzocyclobutene; BCB; photoresist; epoxy; glue; wafer-level; sacrificial; etching; grinding; etch-stop;

    Abstract : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. READ MORE

  2. 2. Mechanical Behaviour of Single-Layer Adhesive Joints : an integrated approach

    Author : Li Högberg; Högskolan i Skövde; []
    Keywords : ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; adhesive layer; beam adhesive layer model; energy release rate; fracture; integrated; Engineering mechanics; Teknisk mekanik; Teknik; Technology;

    Abstract : Innovative products that are competitive on the market are likely to employ newtypes of materials and unusual geometries. A method that can assemble dissimilarmaterials and irregular geometries cost-effectively and at the same time offera joint that is light in weight and imperceptible, is optimal. READ MORE

  3. 3. Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems

    Author : Simon J. Bleiker; Frank Niklaus; Gary K. Fedder; KTH; []
    Keywords : ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; Nano-electromechanical systems NEMS ; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; CMOS integration; Morethan- Moore MtM ; adhesive wafer bonding; NEM switch; FPGA; contact reliability; hermetic vacuum packaging; Cu low-temperature welding; through silicon vias TSVs ; magnetic self-assembly;

    Abstract : Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. READ MORE

  4. 4. Structural adhesive bonding of metals : surface and fracture mechanics aspects

    Author : Margareta Ring Groth; Luleå tekniska universitet; []

    Abstract : Strukturell, eller lastbärande, limning ökar alltmer i volym. Strukturell limning har tidigare mest använts i flygindustrin för lätta metaller och legeringar, men används nu inom ett flertal industrier för andra material. READ MORE

  5. 5. Shape stability of laminated veneer products

    Author : Lars Blomqvist; Dick Sandberg; Jimmy Johansson; Magdalena Sterley; Linnéuniversitetet; []
    Keywords : AGRICULTURAL SCIENCES; LANTBRUKSVETENSKAPER; LANTBRUKSVETENSKAPER; AGRICULTURAL SCIENCES; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; adhesive; beech; birch; bending; laminated veneer products; moulding; shape stability; spring-back; twist; veneer; Forestry and Wood Technology; Skog och träteknik; wood;

    Abstract : This thesis is about the shape stability of laminated veneer products.Laminated veneer products consist of veneers bonded together with adhesive into a predetermined shape. Such products are used in several contexts but especially in furniture manufacture. READ MORE