Search for dissertations about: "adhesive systems"

Showing result 1 - 5 of 56 swedish dissertations containing the words adhesive systems.

2. 1. Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

   Author : Niklaus Frank; KTH; []
   Keywords : adhesive; wafer; bonding; low temperature; CMOS compatible; selective; local; polymer; thermoplastic; thermosetting; intermediate layer; coating; benzocyclobutene; BCB; photoresist; epoxy; glue; wafer-level; sacrificial; etching; grinding; etch-stop;

   Abstract : Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. READ MORE

4. 2. Mechanical Behaviour of Single-Layer Adhesive Joints : an integrated approach

   Author : Li Högberg; Högskolan i Skövde; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; adhesive layer; beam adhesive layer model; energy release rate; fracture; integrated; Engineering mechanics; Teknisk mekanik; Teknik; Technology;

   Abstract : Innovative products that are competitive on the market are likely to employ newtypes of materials and unusual geometries. A method that can assemble dissimilarmaterials and irregular geometries cost-effectively and at the same time offera joint that is light in weight and imperceptible, is optimal. READ MORE

5. 3. Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems

   Author : Simon J. Bleiker; Frank Niklaus; Gary K. Fedder; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Nano-electromechanical systems NEMS ; Micro-electromechanical systems MEMS ; heterogeneous 3D integration; CMOS integration; Morethan- Moore MtM ; adhesive wafer bonding; NEM switch; FPGA; contact reliability; hermetic vacuum packaging; Cu low-temperature welding; through silicon vias TSVs ; magnetic self-assembly;

   Abstract : Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. READ MORE

6. 4. Structural adhesive bonding of metals : surface and fracture mechanics aspects

   Author : Margareta Ring Groth; Luleå tekniska universitet; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Manufacturing Systems Engineering; Produktionsutveckling;

   Abstract : Strukturell, eller lastbärande, limning ökar alltmer i volym. Strukturell limning har tidigare mest använts i flygindustrin för lätta metaller och legeringar, men används nu inom ett flertal industrier för andra material. READ MORE

7. 5. Shape stability of laminated veneer products

   Author : Lars Blomqvist; Dick Sandberg; Jimmy Johansson; Magdalena Sterley; Linnéuniversitetet; []
   Keywords : LANTBRUKSVETENSKAPER; AGRICULTURAL SCIENCES; adhesive; beech; birch; bending; laminated veneer products; moulding; shape stability; spring-back; twist; veneer; Forestry and Wood Technology; Skog och träteknik;

   Abstract : This thesis is about the shape stability of laminated veneer products.Laminated veneer products consist of veneers bonded together with adhesive into a predetermined shape. Such products are used in several contexts but especially in furniture manufacture. READ MORE