Search for dissertations about: "carbon nanotubes for electronic packaging"

Showing result 1 - 5 of 13 swedish dissertations containing the words carbon nanotubes for electronic packaging.

2. 1. Carbon Nanotubes for Electronic Packaging: Growth, Novel Devices and 3D Networks

   Author : Yifeng Fu; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; multi-scale modeling; electrospinning; microfin; PDMS; chemical vapor deposition CVD ; Carbon nanotube CNT ; double-walled CNT DWNT ; CNT covalent bonding; CNT transfer; thermal management; packaging;

   Abstract : Carbon nanotubes (CNTs) have shown great potential of application in electronics because of their attractive physical properties, such as high surface-to-volume ratio, high electron mobility, high Young’s modulus, high thermal conductivity, low thermal expansion coefficient, etc. However, many obstacles are yet to be removed to use CNTs as building blocks in electronic systems. READ MORE

4. 2. Carbon Nanotube Based Interconnect Material for Electronic Applications

   Author : Di Jiang; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; electrical interconnect; bump; densification; electronics packaging; carbon nanotube; three dimensional integration; flexible electronics; through silicon via; transfer;

   Abstract : Carbon nanotubes (CNTs) are considered as a candidate material for future electronicinterconnect applications. This thesis summarizes the research work on thefabrication and characterization of CNT-based interconnect systems, and exploresthe possibilities of integrating CNTs into various electronic interconnect scenarios. READ MORE

5. 3. Application of Metallic Nanoparticles and Vertically Aligned Carbon Nanotubes as Interconnect Materials for Electronics Packaging

   Author : Si Chen; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Carbon nanofibers; Fracture surface; Electronics packaging; Thermal fatigue; Electrical resistance; Shear strength; Interconnect materials; Nanocomposite solder;

   Abstract : In the electronics industry, packaging is responsible to protect chip from atmosphere and provide the path for signal communication as well as thermal dissipation. The realization of these functions in a packaging system depends on the performance of interconnect materials. Any failure on the interconnect materials could make entire system down. READ MORE

6. 4. A Theoretical Study of Carbon Nanotubes in Electronic Packaging Applications

   Author : Zhili Hu; Chalmers tekniska högskola; []
   Keywords : NATURVETENSKAP; NATURAL SCIENCES; simulation; thermal interface material; continuum; electronic packaging; MDs; CNT;

   Abstract : The continuous decrease in size of transistors has allowed more components to be integrated in a single unit area and brings a range of opportunities as well as problems to the electronic packaging industry. To meet these challenges, the introduction of Carbon Nanotubes (CNT), which display a series of extraordinary properties, have attracted great interest. READ MORE

7. 5. Towards 3D Integration of Carbon Based Electronics

   Author : Wei Mu; Chalmers tekniska högskola; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; transfer; carbon nanomaterials; polymer filling; MWCNTs; interconnect; 3D integration; packaging; graphene; horizontally aligned SWCNTs; through silicon via;

   Abstract : Carbon-based nanomaterials such as carbon nanotubes (CNTs) and graphene, which possess superior electrical, thermal and mechanical properties, have been proposed as alternative materials for future electronics. The proposed applications span from the device level, replacing silicon-based transistors, with single-walled carbon nanotubes (SWCNTs) or graphene, to packaging level using multi-walled carbon nanotubes (MWCNTs) for interconnects. READ MORE