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Showing result 1 - 5 of 14 swedish dissertations matching the above criteria.

2. 1. Chemical Mechanical Polishing of Silicon and Silicon Dioxide in Front End Processing

   Author : Markus Forsberg; Jörgen Olsson; Jyrki Molarius; Uppsala universitet; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Electronics; chemical mechanical polishing; chemical mechanical planarization; silicon; silicon dioxide; front end; shallow trench isolation; deep trench isolation; bipolar transistor; BiCMOS; wafer bonding; Elektronik; Electronics; Elektronik;

   Abstract : Chemical mechanical polishing (CMP) has been used for a long time in the manufacturing of prime silicon wafers for the IC industry. Lately, other substrates, such as silicon-on-insulator has become in use which requires a greater control of the silicon CMP process. READ MORE

4. 2. The influence of microstructure on mechanical and tribological properties of lamellar and compacted irons in engine applications

   Author : Rohollah Ghasemi; Anders E. W. Jarfors; Ricardo César Dommarco; Jönköping University; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Cast iron; Si solution-strengthened CGI; microstructure; mechanical properties; modelling and simulation; tribology; abrasive wear; scratch testing;

   Abstract : Lamellar graphite iron (LGI) is commonly used in diesel engine applications such as piston rings–cylinder liner where an excellent combination of physical and tribological properties is essential to avoid scuffing and bore polishing issues. The excellent tribological behaviour of LGI alloys is related to the graphite lamellas, which act as solid lubricant agents by feeding onto the tribosurfaces under sliding conditions. READ MORE

5. 3. Investigation of New Concepts and Solutions for Silicon Nanophotonics

   Author : Zhechao Wang; Lech Wosinski; Kresten Yvind; KTH; []
   Keywords : NATURVETENSKAP; NATURAL SCIENCES; Planar integrated circuit; silicon photonics; slot waveguide; finite-difference time-domain; waveguide grating coupler; ring resonator; polarization diversity scheme; polarization beam splitter; polarization rotator; hybrid silicon laser; epitaxial lateral overgrowth; chemical-mechanical polishing.; Optics; Optik;

   Abstract : Nowadays, silicon photonics is a widely studied research topic. Its high-index-contrast and compatibility with the complementary metal-oxide-semiconductor technology make it a promising platform for low cost high density integration. READ MORE

6. 4. Fabrication of Group IV Semiconductors on Insulator for Monolithic 3D Integration

   Author : Ali Asadollahi; Mikael Östling; Paul R. Berger; KTH; []
   Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; monolithic three dimensional M3D integration; strained germanium on insulator sGeOI pMOSFETs; silicon silicon-germanium on insulator sSOI sSiGeOI nMOSFETs; Si0.5Ge0.5 strain-relaxed buffer SRB ; direct bonding; chemical mechanical polishing CMP ; compressively strained GeOI; tensile strained Si0.5Ge0.5OI;

   Abstract : The conventional 2D geometrical scaling of transistors is now facing many challenges in order to continue the performance enhancement while decreasing power consumption. The decrease in the device power consumption is related to the scaling of the power supply voltage (Vdd) and interconnects wiring length. READ MORE

7. 5. Epitaxy and characterization of SiGeC layers grown by reduced pressure chemical vapor deposition

   Author : Julius Hållstedt; KTH; []
   Keywords : Silicon germanium carbon SiGeC ; Epitaxy; Chemical vapor deposition CVD ; Loading effect; High resolution x-ray diffraction HRXRD ; Hall measurements; Atomic force microscopy AFM .;

   Abstract : Heteroepitaxial SiGeC layers have attracted immenseattention as a material for high frequency devices duringrecent years. The unique properties of integrating carbon inSiGe are the additional freedom for strain and bandgapengineering as well as allowing more aggressive device designdue to the potential for increased thermal budget duringprocessing. READ MORE