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Showing result 1 - 5 of 14 swedish dissertations matching the above criteria.
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1. Chemical Mechanical Polishing of Silicon and Silicon Dioxide in Front End Processing
Abstract : Chemical mechanical polishing (CMP) has been used for a long time in the manufacturing of prime silicon wafers for the IC industry. Lately, other substrates, such as silicon-on-insulator has become in use which requires a greater control of the silicon CMP process. READ MORE
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2. The influence of microstructure on mechanical and tribological properties of lamellar and compacted irons in engine applications
Abstract : Lamellar graphite iron (LGI) is commonly used in diesel engine applications such as piston rings–cylinder liner where an excellent combination of physical and tribological properties is essential to avoid scuffing and bore polishing issues. The excellent tribological behaviour of LGI alloys is related to the graphite lamellas, which act as solid lubricant agents by feeding onto the tribosurfaces under sliding conditions. READ MORE
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3. Investigation of New Concepts and Solutions for Silicon Nanophotonics
Abstract : Nowadays, silicon photonics is a widely studied research topic. Its high-index-contrast and compatibility with the complementary metal-oxide-semiconductor technology make it a promising platform for low cost high density integration. READ MORE
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4. Fabrication of Group IV Semiconductors on Insulator for Monolithic 3D Integration
Abstract : The conventional 2D geometrical scaling of transistors is now facing many challenges in order to continue the performance enhancement while decreasing power consumption. The decrease in the device power consumption is related to the scaling of the power supply voltage (Vdd) and interconnects wiring length. READ MORE
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5. Epitaxy and characterization of SiGeC layers grown by reduced pressure chemical vapor deposition
Abstract : Heteroepitaxial SiGeC layers have attracted immenseattention as a material for high frequency devices duringrecent years. The unique properties of integrating carbon inSiGe are the additional freedom for strain and bandgapengineering as well as allowing more aggressive device designdue to the potential for increased thermal budget duringprocessing. READ MORE