Search for dissertations about: "chip-level"
Found 5 swedish dissertations containing the word chip-level.
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1. Towards Unconventional Applications of Wire Bonding
Abstract : This thesis presents novel heterogeneous integration approaches of wire materials to fabricated and package MEMS devices by exploring unconventional applications of wire bonding technology. Wire bonding, traditionally endemic in the realm of device packaging to establish electrical die-to-package interconnections, is an attractive back-end technology, offering promising features, such as high throughput, flexibility and placement accuracy. READ MORE
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2. Integration and Fabrication Techniques for 3D Micro- and Nanodevices
Abstract : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. READ MORE
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3. Design of High Linearity MMIC Power Amplifiers for Space Applications
Abstract : The high linearity performance in satellite transmitters is receiving increasing attention due to the demands of higher data rates in satellite communication links. During the last decade, digital communication links in satellite system have been replacing the previous analog links increasing the channel efficiency by allocating multiple carriers in the transponder bandwidth. READ MORE
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4. Alternative electronic packaging concepts for high frequency electronics
Abstract : The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize the technology of electronic packaging. READ MORE
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5. Flip-Chip Interconnect for Millimeter-Wave Packaging Applications
Abstract : In recent years, with the demands for wireless communication systems increas rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC components but also competent package with low cost and good interconnect performance. READ MORE