Search for dissertations about: "circuit packaging"

Showing result 1 - 5 of 33 swedish dissertations containing the words circuit packaging.

  1. 1. Integration and Fabrication Techniques for 3D Micro- and Nanodevices

    Author : Andreas C. Fischer; Frank Niklaus; Karl F. Böhringer; KTH; []
    Keywords : Microelectromechanical systems; MEMS; Nanoelectromechanical systems; NEMS; silicon; wafer-level; chip-level; through silicon via; TSV; packaging; 3D packaging; vacuum packaging; liquid encapsulation; integration; heterogeneous integration; wafer bonding; microactuators; shape memory alloy; SMA; wire bonding; magnetic assembly; self-assembly; 3D; 3D printing; focused ion beam; FIB;

    Abstract : The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. READ MORE

  2. 2. InP DHBT Amplifiers and Circuit Packaging up to Submillimeter-Wave Frequencies

    Author : Klas Eriksson; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; InP; WR05; packaging; noise figure; substrate modes; WR03.; multiple layer interconnect; double heterojunction bipolar transistor DHBT ; G-band; wideband; H-band; waveguide transition; distributed amplifier DA ; millimeter-wave; amplifier; low-noise amplifier LNA ; membrane technology; waveguide module; submillimeter-wave;

    Abstract : This thesis treats the design and characterization of amplifiers operating up tosubmillimeter-wave frequencies and packaging of such circuits into waveguidemodules. The circuits use an advanced indium phosphide (InP) double heterojunctionbipolar transistor (DHBT) process with a multilayer back-end. READ MORE

  3. 3. Gap waveguide for packaging microstrip filters & investigation of transitions from planar technologies to ridge gap waveguide

    Author : Astrid Algaba Brazalez; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; parallel plate mode; coupled line filter; microstrip circuit; packaging; Artificial magnetic conductor AMC ; perfect magnetic conductor PMC ; gap waveguide; transition.; coplanar waveguide CPW ;

    Abstract : Gap waveguide technology has proved to constitute an effective alternative for the design of microwave passive components, due to its advantages with respect to traditional planar technologies and standard waveguides. There is no requirement for conductive contact between the two different metal pieces making up a gap waveguide prototype, since one of these pieces makes use of a textured surface that eliminates any possible leakage of the field through the gap to the surface of the other metal piece above it. READ MORE

  4. 4. Gap Waveguide Technology- Electromagnetic Packaging and Transitions

    Author : Astrid Algaba Brazalez; Chalmers tekniska högskola; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; rectangular waveguide; packaging; transition; coplanar waveguide; microstrip; millimeter waves; gap waveguide; perfect magnetic conductor;

    Abstract : The scarcity of available frequency bands for new wireless communication systems, as well as the growing need for higher capacity, motivates the current interest in moving upwards in frequency. The millimeter wave frequencyrange is very attractive to allocate potential commercial opportunities such as short range wireless communications that allow high-speed data/video transmission, and automotive radars for both driver assistance and increasedsafety. READ MORE

  5. 5. Integration and Packaging Concepts for Infrared Bolometer Arrays

    Author : Adit Decharat; Göran Stemme; Sjoerd Haasl; KTH; []
    Keywords : TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Fabrication; Bonding; packaging; microbolometer; Thermal imaging.; Other electrical engineering; electronics and photonics; Övrig elektroteknik; elektronik och fotonik;

    Abstract :   Infrared (IR) imaging devices based on energy detection has shown a dramatic development in technology along with an impressive price reduction in recent years. However, for a low-end market as in automotive applications, the present cost of IR cameras is still the main obstacle to broadening their usage. READ MORE