Search for dissertations about: "copper films"

Showing result 1 - 5 of 42 swedish dissertations containing the words copper films.

  1. 1. Metal Films for Printed Electronics : Ink-substrate Interactions and Sintering

    Author : Thomas Öhlund; Håkan Olin; Hans-Erik Nilsson; Mattias Andersson; Patrick Gane; Mittuniversitetet; []
    Keywords : NATURAL SCIENCES; NATURVETENSKAP; ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; NATURVETENSKAP; NATURAL SCIENCES; inkjet printing; silver nanoparticles; paper; flexible substrates; sintering; printed electronics; IPL sintering; flash sintering; copper films; coatings; thin films; AgNP; conductive films; metal films;

    Abstract : A new manufacturing paradigm may lower the cost and environmental impact of existing products, as well as enable completely new products. Large scale, roll-to-roll manufacturing of flexible electronics and other functionality has great potential. READ MORE

  2. 2. Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates

    Author : Tobias Törndahl; Jan-Otto Carlsson; Karin Larsson; Mikael Ottosson; Lauri Niinistö; Uppsala universitet; []
    Keywords : NATURAL SCIENCES; NATURVETENSKAP; NATURVETENSKAP; NATURAL SCIENCES; Inorganic chemistry; Atomic Layer Deposition; ALD; copper; copper I oxide; copper I nitride; deposition pathway; CuCl; Cu hfac 2; oxide substrates; epitaxy; DFT; ab-initio; Oorganisk kemi; Inorganic chemistry; Oorganisk kemi;

    Abstract : Thin films play an important role in science and technology today. By combining different materials, properties for specific applications can be optimised. READ MORE

  3. 3. Atomic layer epitaxy of copper

    Author : Per Mårtensson; Uppsala universitet; []
    Keywords : NATURAL SCIENCES; NATURVETENSKAP; Chemistry; Atomic Layer Epitaxy; ALE; copper; ab initio calculations; DFT; CuCl; Cu thd 2; selectivity; Kemi; Chemistry; Kemi; Inorganic Chemistry; oorganisk kemi;

    Abstract : The high electric and thermal conductivity of copper has made it to a prime candidate as interconnect material in future integrated circuits. In this thesis, Atomic Layer Epitaxy has been used to deposit thin copper films on a variety of substrates, using both CuCl and Cu(II)2,2,6,6-tetramethyl-3,5-heptanedionate, Cu(thd)2, as precursors and hydrogen as reducing agent. READ MORE

  4. 4. Copper and Silver Metallization for High Temperature Applications

    Author : Shabnam Mardani; Shili Zhang; Hans Norström; Jörgen Olsson; Christophe Detavernier Detavernier; Uppsala universitet; []
    Keywords : ENGINEERING AND TECHNOLOGY; TEKNIK OCH TEKNOLOGIER; TEKNIK OCH TEKNOLOGIER; ENGINEERING AND TECHNOLOGY; Metallization; Copper; Silver; Tantalum; High tempreture; Diffussion; Electromigration; Stability;

    Abstract : High-temperature electrical- and morphological-stability of interconnect is critical for electronic systems based on wide band gap (WBG) semiconductors. In this context, the thermal stability of both Ag and Cu films with Ta and TaN films as diffusion barriers and/or surface-capping layers at high temperatures up to 800 oC is investigated in this thesis. READ MORE

  5. 5. Chemical Vapour Deposition of Undoped and Oxygen Doped Copper (I) Nitride

    Author : Anna Fallberg; Jan-Otto Carlsson; Mikael Ottosson; Kwang-Leong Choy; Uppsala universitet; []
    Keywords : NATURAL SCIENCES; NATURVETENSKAP; NATURVETENSKAP; NATURAL SCIENCES; Chemical vapour deposition; copper hexafluoroacetylacetonate; copper I nitride; copper I oxide; multilayers; oxygen doping; Organic chemistry; Organisk kemi; Inorganic Chemistry; oorganisk kemi;

    Abstract : In science and technology there is a steadily increased demand of new materials and new materials production processes since they create new application areas as well as improved production technology and economy. This thesis includes development and studies of a chemical vapour deposition (CVD) process for growth of thin films of the metastable material copper nitride, Cu3N, which is a semiconductor and decomposes at around 300 oC. READ MORE